参数资料
型号: LT1206CS8#TR
厂商: Linear Technology
文件页数: 8/18页
文件大小: 0K
描述: IC AMP CURR FEEDBACK 250MA 8SOIC
标准包装: 2,500
放大器类型: 电流反馈
电路数: 1
转换速率: 900 V/µs
-3db带宽: 60MHz
电流 - 输入偏压: 10µA
电压 - 输入偏移: 3000µV
电流 - 电源: 20mA
电流 - 输出 / 通道: 1.2A
电压 - 电源,单路/双路(±): 10 V ~ 30 V,±5 V ~ 15 V
工作温度: 0°C ~ 70°C
安装类型: 表面贴装
封装/外壳: 8-SOIC(0.154",3.90mm 宽)
供应商设备封装: 8-SO
包装: 带卷 (TR)
LT1206
16
1206fb
package DescripTion
T7 Package
7-Lead Plastic TO-220 (Standard)
(Reference LTC DWG # 05-08-1422)
.050
(1.27)
.026 – .036
(0.660 – 0.914)
T7 (TO-220) 0801
.135 – .165
(3.429 – 4.191)
.700 – .728
(17.780 – 18.491)
.045 – .055
(1.143 – 1.397)
.165 – .180
(4.191 – 4.572)
.095 – .115
(2.413 – 2.921)
.013 – .023
(0.330 – 0.584)
.620
(15.75)
TYP
.155 – .195*
(3.937 – 4.953)
.152 – .202
(3.860 – 5.130)
.260 – .320
(6.604 – 8.128)
.147 – .155
(3.734 – 3.937)
DIA
.390 – .415
(9.906 – 10.541)
.330 – .370
(8.382 – 9.398)
.460 – .500
(11.684 – 12.700)
.570 – .620
(14.478 – 15.748)
.230 – .270
(5.842 – 6.858)
BSC
SEATING PLANE
*MEASURED AT THE SEATING PLANE
.016 – .050
(0.406 – 1.270)
.010 – .020
(0.254 – 0.508)
× 45°
0°– 8° TYP
.008 – .010
(0.203 – 0.254)
SO8 0303
.053 – .069
(1.346 – 1.752)
.014 – .019
(0.355 – 0.483)
TYP
.004 – .010
(0.101 – 0.254)
.050
(1.270)
BSC
1
2
3
4
.150 – .157
(3.810 – 3.988)
NOTE 3
8
7
6
5
.189 – .197
(4.801 – 5.004)
NOTE 3
.228 – .244
(5.791 – 6.197)
.245
MIN
.160 ±.005
RECOMMENDED SOLDER PAD LAYOUT
.045 ±.005
.050 BSC
.030 ±.005
TYP
INCHES
(MILLIMETERS)
NOTE:
1. DIMENSIONS IN
2. DRAWING NOT TO SCALE
3. THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.
MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .006" (0.15mm)
S8 Package
8-Lead Plastic Small Outline (Narrow .150 Inch)
(Reference LTC DWG # 05-08-1610)
相关PDF资料
PDF描述
0314006.MXP FUSE CERAMIC 250V FAST 3AB 6A
961106-6300-AR-TP CONN HEADER VERT 6POS GOLD SMD
PBC29DBEN CONN HEADER .100 DUAL R/A 58POS
9-103801-0-37 CONN HEADR BRKWAY .100 74POS R/A
951104-2530-AR-PT CONN HEADER 4POS 2MM VERT SMD
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