参数资料
型号: LT1766EFE-5#TRPBF
厂商: Linear Technology
文件页数: 28/30页
文件大小: 0K
描述: IC REG BUCK 5V 1.5A 16TSSOP
标准包装: 2,500
类型: 降压(降压)
输出类型: 固定
输出数: 1
输出电压: 5V
输入电压: 5.5 V ~ 60 V
PWM 型: 电流模式
频率 - 开关: 200kHz
电流 - 输出: 1.5A
同步整流器:
工作温度: -40°C ~ 125°C
安装类型: 表面贴装
封装/外壳: 16-TSSOP(0.173",4.40mm)裸露焊盘
包装: 带卷 (TR)
供应商设备封装: 16-TSSOP-EP
LT1766/LT1766-5
PACKAGE DESCRIPTION
FE Package
16-Lead Plastic TSSOP (4.4mm)
(Reference LTC DWG # 05-08-1663)
Exposed Pad Variation BB
3.58
(.141)
1.10
4.90 – 5.10*
(.193 – .201)
3.58
(.141)
6.60 0.10
2.94
4.30 – 4.50*
(.169 – .177)
0.25
REF
0 –8
(.0433)
MAX
16 1514 13 12 11 10
9
4.50 0.10
(.116)
2.94
SEE NOTE 4
0.45 0.05
1.05 0.10
0.09 – 0.20
(.0035 – .0079)
0.50 – 0.75
(.020 – .030)
0.65
(.0256)
BSC
0.195 – 0.30
(.0077 – .0118)
0.05 – 0.15
(.002 – .006)
6.40
(.116) (.252)
BSC
0.65 BSC
NOTE:
1. CONTROLLING DIMENSION: MILLIMETERS
TYP
4. RECOMMENDED MINIMUM PCB METAL SIZE
RECOMMENDED SOLDER PAD LAYOUT
2. DIMENSIONS ARE IN
MILLIMETERS
(INCHES)
FOR EXPOSED PAD ATTACHMENT
*DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH
1 2 3 4 5 6 7 8
FE16 (BB) TSSOP 0204
3. DRAWING NOT TO SCALE
SHALL NOT EXCEED 0.150mm (.006") PER SIDE
GN Package
16-Lead Plastic SSOP (Narrow .150 Inch)
(Reference LTC DWG # 05-08-1641)
.045 .005
.189 – .196*
(4.801 – 4.978)
.009
.015
(0.38
.004
0.10)
45
.0532 – .0688
(1.35 – 1.75)
.004 – .0098
(0.102 – 0.249)
16 15 14 13 12 11 10 9
(0.229)
REF
.254 MIN
.007 – .0098
.150 – .165 (0.178 – 0.249)
0 – 8 TYP
.016 – .050
(0.406 – 1.270)
.008 – .012
(0.203 – 0.305)
.0250
(0.635)
.229 – .244
(5.817 – 6.198)
.150 – .157* *
(3.810 – 3.988)
TYP
BSC
2. DIMENSIONS ARE IN
.0165   .0015                                                .0250 BSC
RECOMMENDED SOLDER PAD LAYOUT
NOTE:
1. CONTROLLING DIMENSION: INCHES
INCHES
(MILLIMETERS)
3. DRAWING NOT TO SCALE
*DIMENSION DOES NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED 0.006" (0.152mm) PER SIDE
**DIMENSION DOES NOT INCLUDE INTERLEAD FLASH. INTERLEAD
FLASH SHALL NOT EXCEED 0.010" (0.254mm) PER SIDE
1
2 3
4
5 6
7
8
GN16 (SSOP) 0204
1766fc
28
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