参数资料
型号: LT1769CGN
厂商: Linear Technology
文件页数: 2/16页
文件大小: 0K
描述: IC BATT CHARGER CONST I/V 28SSOP
标准包装: 49
功能: 充电管理
电池化学: 铅酸,锂离子,镍镉,镍氢
电源电压: 8 V ~ 25 V
工作温度: 0°C ~ 70°C
安装类型: 表面贴装
封装/外壳: 28-SSOP(0.154",3.90mm 宽)
供应商设备封装: 28-SSOP
包装: 管件
产品目录页面: 1340 (CN2011-ZH PDF)
LT1769
ABSOLUTE M AXI M U M RATINGS (Note 1)
Supply Voltage
(V CC , CLP and CLN Pin Voltage) ......................... 30V
BOOST Pin Voltage with Respect to V CC ................. 25V
I BAT (Average)........................................................... 2A
Operating Junction Temperature Range
Commercial ........................................... 0 ° C to 125 ° C
Industrial ......................................... – 40 ° C to 125 ° C
PACKAGE/ORDER I N FOR M ATIO N
Operating Ambient Temperature
Commercial ............................................ 0 ° C to 70 ° C
Industrial ........................................... – 40 ° C to 85 ° C
Storage Temperature Range ................. – 65 ° C to 150 ° C
Lead Temperature (Soldering, 10 sec).................. 300 ° C
TOP VIEW
ORDER PART
ORDER PART
GND**
1
28 GND**
NUMBER
TOP VIEW
NUMBER
GND**
GND**
SW
BOOST
UV
GND**
GND**
2
3
4
5
6
7
8
27 GND**
26 GND**
25 V CC1 *
24 V CC2 *
23 V CC3 *
22 GND**
21 PROG
LT1769CGN
LT1769IGN
*ALL V CC PINS SHOULD
BE CONNECTED
SW
BOOST
UV
GND
GND
OVP
CLN
1
2
3
4
5
6
7
20 GND
19 V CC1
18 V CC2
17 V CC3
16 PROG
15 V C
14 GND
LT1769CFE
LT1769IFE
OVP 9
CLP 10
CLN 11
20 V C
19 UV OUT
18 COMP2
TOGETHER CLOSE TO
THE PINS
** ALL GND PINS ARE
FUSED TO INTERNAL DIE
ATTACH PADDLE FOR
CLP 8
COMP1 9
SENSE 10
13 UV OUT
12 BAT
11 SPIN
EXPOSED PAD SIZE: 3.0 × 4.1
COMP1 12 17 BAT
SENSE 13 16 SPIN
GND** 14 15 GND**
GN PACKAGE
28-LEAD PLASTIC SSOP
T JMAX = 125 ° C, θ JA = 35 ° C/ W**
HEAT SINKING. CONNECT
THESE PINS TO
EXPANDED PC LANDS
FOR PROPER HEAT
SINKING. 35 ° C/W
THERMAL RESISTANCE
ASSUMES AN INTERNAL
GROUND PLANE
DOUBLING AS A HEAT
SPREADER
FE PACKAGE
20-LEAD PLASTIC TSSOP
T JMAX = 125 ° C, θ JA = 35 ° C/ W ?
EXPOSED PAD IS GROUND
(MUST BE SOLDERED TO PCB)
(.188) (.162)
? THE BOTTOM METAL
PLATE OF THIS PACKAGE
IS FUSED TO INTERNAL
GROUND AND IS FOR
HEAT SINKING. SOLDER
THE BOTTOM METAL
PLATE ONTO PCB
GROUND PLANE FOR
HEAT SINKING.
Consult LTC Marketing for parts specified with wider operating temperature ranges.
ELECTRICAL CHARACTERISTICS The q denotes specifications which apply over the full operating
temperature range, otherwise specifications are at T A = 25 ° C. V CC = 16V, V BAT = 8V, R S2 = R S3 = 200 ? (see Block Diagram),
V CLN = V CC . No load on any outputs unless otherwise noted.
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
Overall
Supply Current
V PROG = 2.7V, V CC ≤ 20V
V PROG = 2.7V, 20V < V CC ≤ 25V
q
q
4.5
4.6
6.8
7.0
mA
mA
Sense Amplifier CA1 Gain and Input Offset Voltage
(With R S2 = 200 ? , R S3 = 200 ? )
(Measured across R S1 )(Note 2)
8V ≤ V CC ≤ 25V , 0V ≤ V BAT ≤ 20V
R PROG = 4.93k
R PROG = 49.3k
T A < 0 ° C
q
q
93
8
7
100
10
107
12
13
mV
mV
mV
V CC = 28V, V BAT = 20V
R PROG = 4.93k
R PROG = 49.3k
T A < 0 ° C
q
q
90
7
6
110
13
14
mV
mV
mV
1769fa
2
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