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参数资料
| 型号： | LT1964IS5-SD#TRMPBF |
| 厂商： | Linear Technology |
| 文件页数： | 15/16页 |
| 文件大小： | 0K |
| 描述： | IC REG LDO NEG ADJ .2A TSOT23-5 |
| 产品培训模块： | More Information on LDOs |
| 标准包装： | 500 |
| 稳压器拓扑结构： | 负，可调式 |
| 输出电压： | -1.22 V ~ -20 V |
| 输入电压： | -1.6 V ~ -20 V |
| 电压 - 压降（标准）： | 0.34V @ 200mA |
| 稳压器数量： | 1 |
| 电流 - 输出： | 200mA |
| 电流 - 限制（最小）： | 220mA |
| 工作温度： | -40°C ~ 125°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | SOT-23-5 细型，TSOT-23-5 |
| 供应商设备封装： | TSOT-23-5 |
| 包装： | 带卷 (TR) |
LT1964
PACKAGE DESCRIPTION
S5 Package
5-Lead Plastic TSOT-23
(Reference LTC DWG # 05-08-1635)
0.62
MAX
0.95
REF
1.22 REF
2.90 BSC
(NOTE 4)
3.85 MAX 2.62 REF
1.4 MIN
2.80 BSC
1.50 – 1.75
(NOTE 4)
PIN ONE
0.20 BSC
RECOMMENDED SOLDER PAD LAYOUT
PER IPC CALCULATOR
0.95 BSC
0.80 – 0.90
0.30 – 0.45 TYP
5 PLCS (NOTE 3)
0.01 – 0.10
1.00 MAX
DATUM ‘A’
NOTE:
0.30 – 0.50 REF
0.09 – 0.20
(NOTE 3)
1.90 BSC
S5 TSOT-23 0302 REV B
1. DIMENSIONS ARE IN MILLIMETERS
2. DRAWING NOT TO SCALE
3. DIMENSIONS ARE INCLUSIVE OF PLATING
4. DIMENSIONS ARE EXCLUSIVE OF MOLD FLASH AND METAL BURR
5. MOLD FLASH SHALL NOT EXCEED 0.254mm
6. JEDEC PACKAGE REFERENCE IS MO-193
DD Package
8-Lead Plastic DFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1698)
0.675 ±0.05
R = 0.115
TYP
5
8
0.38 ± 0.10
3.5 ±0.05
1.65 ±0.05
3.00 ±0.10
1.65 ± 0.10
2.15 ±0.05 (2 SIDES)
PACKAGE
OUTLINE
PIN 1
TOP MARK
(NOTE 6)
(4 SIDES)
(2 SIDES)
4
1
(DD) DFN 1203
0.25 ± 0.05
0.50
0.200 REF
0.75 ±0.05
0.25 ± 0.05
0.50 BSC
BSC
2.38 ±0.10
2.38 ±0.05
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
NOTE:
0.00 – 0.05
(2 SIDES)
BOTTOM VIEW—EXPOSED PAD
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-1)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON TOP AND BOTTOM OF PACKAGE
1964fb
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
15
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