参数资料
型号: LT3008EDC-1.2#TRMPBF
厂商: Linear Technology
文件页数: 15/20页
文件大小: 0K
描述: IC REG LDO 1.2V 20MA 6-DFN
产品培训模块: More Information on LDOs
标准包装: 1
稳压器拓扑结构: 正,固定式
输出电压: 1.2V
输入电压: 2 V ~ 45 V
电压 - 压降(标准): 0.3V @ 20mA
稳压器数量: 1
电流 - 输出: 20mA
电流 - 限制(最小): 22mA
工作温度: -40°C ~ 125°C
安装类型: 表面贴装
封装/外壳: 6-WFDFN 裸露焊盘
供应商设备封装: 6-DFN-EP(2x2)
包装: 标准包装
产品目录页面: 1330 (CN2011-ZH PDF)
其它名称: LT3008EDC-1.2#TRMPBFDKR
LT3008 Series
APPLICATIONS INFORMATION
Table 3: Measured Thermal Resistance for TSOT-23 Package
So,
COPPER AREA
BOARD
THERMAL RESISTANCE
P = 20mA(12.6V – 3.3V) + 0.3mA(12.6V) = 189.8mW
TOPSIDE*
2500mm 2
1000mm 2
225mm 2
100mm 2
50mm 2
BACKSIDE
2500mm 2
2500mm 2
2500mm 2
2500mm 2
2500mm 2
AREA
2500mm 2
2500mm 2
2500mm 2
2500mm 2
2500mm 2
(JUNCTION-TO-AMBIENT)
65°C/W
67°C/W
70°C/W
75°C/W
85°C/W
The thermal resistance ranges from 65°C/W to 85°C/W
depending on the copper area. So, the junction temperature
rise above ambient approximately equals:
0.1898W(75°C/W) = 14.2°C
The maximum junction temperature equals the maximum
*Device is mounted on the topside.
For example, a 4-layer, 1 ounce copper PCB board with
3 thermal vias from the DFN exposed backside or the
3 fused TSOT-23 GND pins to inner layer GND planes
achieves 45°C/W thermal resistance. Demo circuit DC
1388A’s board layout achieves this 45°C/W performance.
This is approximately a 30% improvement over the lowest
numbers shown in Tables 2 and 3.
Calculating Junction Temperature
Example: Given an output voltage of 3.3V, an input voltage
range of 12V ±5%, an output current range of 0mA to 20mA
and a maximum ambient temperature of 85°C, what will
the maximum junction temperature be for an application
using the DC package?
The power dissipated by the device is equal to:
I OUT(MAX) (V IN(MAX) – V OUT ) + I GND (V IN(MAX) )
where,
I OUT(MAX) = 20mA
V IN(MAX) = 12.6V
I GND at (I OUT = 20mA, V IN = 12.6V) = 0.3mA
junction temperature rise above ambient plus the maximum
ambient temperature or:
T J(MAX) = 85°C + 14.2°C = 99.2°C
Protection Features
The LT3008 incorporates several protection features that
make it ideal for use in battery-powered circuits. In ad-
dition to the normal protection features associated with
monolithic regulators, such as current limiting and thermal
limiting, the device also protects against reverse-input
voltages, reverse-output voltages and reverse output-to-
input voltages.
Current limit protection and thermal overload protec-
tion protect the device against current overload condi-
tions at the output of the device. For normal operation,
do not exceed a junction temperature of 125°C. The
typical thermal shutdown circuitry temperature threshold
is 160°C.
The IN pin withstands reverse voltages of 50V. The device
limits current ?ow to less than 30μA (typically less than
1μA) and no negative voltage appears at OUT. The device
protects both itself and the load against batteries that are
plugged in backwards.
3008fc
15
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