参数资料
| 型号： | LT3010MPMS8E#TRPBF |
| 厂商： | Linear Technology |
| 文件页数： | 10/18页 |
| 文件大小： | 0K |
| 描述： | IC REG LDO ADJ 50MA 8-MSOP |
| 标准包装： | 2,500 |
| 稳压器拓扑结构： | 正，可调式 |
| 输出电压： | 1.275 V ~ 60 V |
| 输入电压： | 3 V ~ 80 V |
| 电压 - 压降（标准）： | 0.3V @ 50mA |
| 稳压器数量： | 1 |
| 电流 - 输出： | 50mA |
| 电流 - 限制（最小）： | 60mA |
| 工作温度： | -55°C ~ 125°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 8-TSSOP，8-MSOP（0.118"，3.00mm 宽）裸露焊盘 |
| 供应商设备封装： | 8-MSOP-EP |
| 包装： | 带卷 (TR) |
LT3010/LT3010-5
APPLICATIONS INFORMATION
20
0
–20
–40
–60
BOTH CAPACITORS ARE 16V,
1210 CASE SIZE, 10μF
X5R
Y5V
Thermal Considerations
The power handling capability of the device will be lim-
ited by the maximum rated junction temperature (125°C,
LT3010E/LT3010MP or 140°C, LT3010H). The power dissi-
pated by the device will be made up of two components:
1. Output current multiplied by the input/output voltage
differential: I OUT ? (V IN – V OUT ) and,
Y5V
–100
THERMAL RESISTANCE
–80
–100
0 2 4 6 8 10 12 14 16
DC BIAS VOLTAGE (V)
30105 F03
Figure 3. Ceramic Capacitor DC Bias Characteristics
40
20
0
X5R
–20
–40
–60
–80
BOTH CAPACITORS ARE 16V,
1210 CASE SIZE, 10μF
–50 –25 0 25 50 75 100 125
TEMPERATURE (°C)
30105 F04
Figure 4. Ceramic Capacitor Temperature Characteristics
capacitance change over temperature. Capacitance change
due to DC bias with X5R and X7R capacitors is better than
Y5V and Z5U capacitors, but can still be significant enough
to drop capacitor values below appropriate levels. Capaci-
tor DC bias characteristics tend to improve as component
case size increases, but expected capacitance at operating
voltage should be verified.
Voltage and temperature coefficients are not the only
sources of problems. Some ceramic capacitors have a
piezoelectric response. A piezoelectric device generates
voltage across its terminals due to mechanical stress, simi-
lar to the way a piezoelectric accelerometer or microphone
works. For a ceramic capacitor the stress can be induced
by vibrations in the system or thermal transients.
2. GND pin current multiplied by the input voltage:
I GND ? V IN
The GND pin current can be found by examining the GND
Pin Current curves in the Typical Performance Character-
istics. Power dissipation will be equal to the sum of the
two components listed above.
The LT3010 series regulators have internal thermal limiting
designed to protect the device during overload conditions.
For continuous normal conditions the maximum junction
temperature rating of 125°C (LT3010E/LT3010MP) or
140°C (LT3010H) must not be exceeded. It is important
to give careful consideration to all sources of thermal re-
sistance from junction to ambient. Additional heat sources
mounted nearby must also be considered.
For surface mount devices, heat sinking is accomplished
by using the heat spreading capabilities of the PC board
and its copper traces. Copper board stiffeners and plated
through-holes can also be used to spread the heat gener-
ated by power devices.
The following table lists thermal resistance for several
different board sizes and copper areas. All measurements
were taken in still air on 3/32" FR-4 board with one ounce
copper.
Table 1. Measured Thermal Resistance
COPPER AREA
TOPSIDE BACKSIDE BOARD AREA (JUNCTION-TO-AMBIENT)
2500 sq mm 2500 sq mm 2500 sq mm 40°C/W
1000 sq mm 2500 sq mm 2500 sq mm 45°C/W
225 sq mm 2500 sq mm 2500 sq mm 50°C/W
100 sq mm 2500 sq mm 2500 sq mm 62°C/W
30105fe
10
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