参数资料
型号: LT3010MPMS8E#TRPBF
厂商: Linear Technology
文件页数: 16/18页
文件大小: 0K
描述: IC REG LDO ADJ 50MA 8-MSOP
标准包装: 2,500
稳压器拓扑结构: 正,可调式
输出电压: 1.275 V ~ 60 V
输入电压: 3 V ~ 80 V
电压 - 压降(标准): 0.3V @ 50mA
稳压器数量: 1
电流 - 输出: 50mA
电流 - 限制(最小): 60mA
工作温度: -55°C ~ 125°C
安装类型: 表面贴装
封装/外壳: 8-TSSOP,8-MSOP(0.118",3.00mm 宽)裸露焊盘
供应商设备封装: 8-MSOP-EP
包装: 带卷 (TR)
LT3010/LT3010-5
PACKAGE DESCRIPTION
MS8E Package
8-Lead Plastic MSOP, Exposed Die Pad
(Reference LTC DWG # 05-08-1662 Rev I)
BOTTOM VIEW OF
EXPOSED PAD OPTION
1.88
1.88 ± 0.102
(.074 ± .004)
0.889 ± 0.127
(.035 ± .005)
1
(.074)
1.68
(.066)
0.29
REF
0.05 REF
5.23
(.206)
MIN
0.42 ± 0.038
(.0165 ± .0015)
TYP
1.68 ± 0.102  3.20 – 3.45
(.066 ± .004) (.126 – .136)
0.65
(.0256)
BSC
3.00 ± 0.102
(.118 ± .004)
(NOTE 3)
8
8
7 6 5
DETAIL “B”
0.52
(.0205)
REF
DETAIL “B”
CORNER TAIL IS PART OF
THE LEADFRAME FEATURE.
FOR REFERENCE ONLY
NO MEASUREMENT PURPOSE
RECOMMENDED SOLDER PAD LAYOUT
0.254
(.010)
DETAIL “A”
0 ° – 6 ° TYP
4.90 ± 0.152
(.193 ± .006)
3.00 ± 0.102
(.118 ± .004)
(NOTE 4)
GAUGE PLANE
DETAIL “A”
0.53 ± 0.152
(.021 ± .006)
1.10
(.043)
MAX
1
2 3
4
0.86
(.034)
REF
0.18
(.007)
0.22 – 0.38
0.65
(.0256)
BSC
SEATING
PLANE
(.009 – .015)
TYP
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
6. EXPOSED PAD DIMENSION DOES NOT INCLUDE MOLD FLASH. MOLD FLASH ON E-PAD
SHALL NOT EXCEED 0.254mm (.010") PER SIDE.
0.1016 ± 0.0508
(.004 ± .002)
MSOP (MS8E) 0910 REV I
30105fe
16
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