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| 型号： | LT3460ESC6-1#TRMPBF |
| 厂商： | Linear Technology |
| 文件页数： | 11/12页 |
| 文件大小： | 0K |
| 描述： | IC REG BOOST ADJ 0.18A SC70-6 |
| 标准包装： | 500 |
| 类型： | 升压（升压） |
| 输出类型： | 可调式 |
| 输出数： | 1 |
| 输出电压： | 1.26 V ~ 36 V |
| 输入电压： | 2.5 V ~ 16 V |
| PWM 型： | 电流模式 |
| 频率 - 开关： | 650kHz |
| 电流 - 输出： | 180mA |
| 同步整流器： | 无 |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 6-TSSOP，SC-88，SOT-363 |
| 包装： | 带卷 (TR) |
| 供应商设备封装： | SC-70-6 |
LT3460/LT3460-1
PACKAGE DESCRIPTION
SC6 Package
6-Lead Plastic SC70
(Reference LTC DWG # 05-08-1638)
0.47
MAX
0.65
REF
1.16 REF
1.80 – 2.20
(NOTE 4)
INDEX AREA
3.26 MAX 2.1 REF
0.96 MIN
1.80 – 2.40 1.15 – 1.35
(NOTE 4)
(NOTE 6)
PIN 1
RECOMMENDED SOLDER PAD LAYOUT
PER IPC CALCULATOR
0.65 BSC
0.15 – 0.30
6 PLCS (NOTE 3)
0.10 – 0.40
0.80 – 1.00
0.00 – 0.10
REF
1.00 MAX
NOTE:
0.10 – 0.30
0.10 – 0.18
(NOTE 3)
SC6 SC70 0802
1. DIMENSIONS ARE IN MILLIMETERS
2. DRAWING NOT TO SCALE
3. DIMENSIONS ARE INCLUSIVE OF PLATING
4. DIMENSIONS ARE EXCLUSIVE OF MOLD FLASH AND METAL BURR
5. MOLD FLASH SHALL NOT EXCEED 0.254mm
6. DETAILS OF THE PIN 1 INDENTIFIER ARE OPTIONAL,
BUT MUST BE LOCATED WITHIN THE INDEX AREA
7. EIAJ PACKAGE REFERENCE IS EIAJ SC-70
DC Package
6-Lead Plastic DFN (2mm × 2mm)
(Reference LTC DWG # 05-08-1703)
R = 0.115
TYP
0.38 ± 0.05
0.675 ± 0.05
0.56 ± 0.05
(2 SIDES)
4
6
2.50 ± 0.05
1.15 ± 0.05 0.61 ± 0.05
(2 SIDES)
PACKAGE
OUTLINE
0.25 ± 0.05
0.50 BSC
PIN 1 BAR
TOP MARK
(SEE NOTE 6)
0.200 REF
2.00 ± 0.10
(4 SIDES)
0.75 ± 0.05
3
PIN 1
CHAMFER OF
EXPOSED PAD
(DC6) DFN 1103
1
0.25 ± 0.05
0.50 BSC
1.42 ± 0.05
(2 SIDES)
1.37 ± 0.05
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
0.00 – 0.05
BOTTOM VIEW—EXPOSED PAD
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WCCD-2)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
3460fb
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
11
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