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| 型号： | LT3495EDDB-1#TRMPBF |
| 厂商： | Linear Technology |
| 文件页数： | 15/16页 |
| 文件大小： | 0K |
| 描述： | IC REG BOOST ADJ 0.35A 10DFN |
| 标准包装： | 1 |
| 类型： | 升压（升压） |
| 输出类型： | 可调式 |
| 输出数： | 1 |
| 输出电压： | 1.24 V ~ 40 V |
| 输入电压： | 2.3 V ~ 16 V |
| PWM 型： | 混合物 |
| 频率 - 开关： | 可调至 45kHz |
| 电流 - 输出： | 350mA |
| 同步整流器： | 无 |
| 工作温度： | -40°C ~ 125°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 10-WFDFN 裸露焊盘 |
| 包装： | 标准包装 |
| 供应商设备封装： | 10-DFN-EP（3x2） |
| 产品目录页面： | 1331 (CN2011-ZH PDF) |
| 其它名称： | LT3495EDDB-1#TRMPBFDKR |
LT3495/LT3495B/
LT3495-1/LT3495B-1
TYPICAL APPLICATIONS
Wide Input Range SEPIC Converter with 5V Output
Efficiency vs Load Current
INPUT
2.6V TO 12V
C1
2.2μF
TURN ON/OFF
V OUT DIMMING
L1
10μH
C2
1μF
SW CAP
V CC V OUT
LT3495B
SHDN FB
CTRL GND
232k
D1
L2
10μH
C3
10μF
V OUT = 5V
200mA, V IN = 3.3V,
300mA, V IN = 5V,
500mA, V IN = 8V
90
80
70
60
50
V CC = 3.3V
1200
1000
800
600
400
200
3495 TA03a
C1: 2.2μF, 16V, X5R, 0805
C2: 1μF, 16V, X5R, 0805
C3: 10μF, 16V, X5R, 1206
D1: FAIRCHILD SEMI MBR0540
L1, L2: COILCRAFT LPS4018-103MLB
40
0.1
1
10 100
LOAD CURRENT (mA)
0
1000
3495 TA03b
PACKAGE DESCRIPTION
DDB Package
10-Lead Plastic DFN (3mm × 2mm)
(Reference LTC DWG # 05-08-1722 Rev ?)
0.64 ± 0.05
(2 SIDES)
0.70 ± 0.05
3.00 ± 0.10
(2 SIDES)
R = 0.05
TYP
R = 0.115
TYP
6
10
0.40 ± 0.10
5
2.55 ± 0.05
1.15 ± 0.05
0.25 ± 0.05
0.50 BSC
PACKAGE
OUTLINE
PIN 1 BAR
TOP MARK
(SEE NOTE 6)
0.200 REF
2.00 ± 0.10
(2 SIDES)
0.75 ± 0.05
0.64 ± 0.05
(2 SIDES)
0.25 ± 0.05
1
PIN 1
R = 0.20 OR
0.25 × 45 °
CHAMFER
(DDB10) DFN 0905 REV ?
0.50 BSC
2.39 ± 0.05
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
0 – 0.05
2.39 ± 0.05
(2 SIDES)
BOTTOM VIEW—EXPOSED PAD
NOTE:
1. DRAWING CONFORMS TO VERSION (WECD-1) IN JEDEC PACKAGE OUTLINE M0-229
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE
3495b1b1fa
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
15
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