参数资料
型号: LT3755IMSE-2#TRPBF
厂商: Linear Technology
文件页数: 17/26页
文件大小: 0K
描述: IC LED DRVR HP CONS CURR 16-MSOP
标准包装: 2,500
恒定电流:
恒定电压:
拓扑: 回扫,低端,PWM,SEPIC,降压(降压),升压(升压)
输出数: 1
内部驱动器:
类型 - 主要: 车载
类型 - 次要: 白色 LED
频率: 100kHz ~ 1MHz
电源电压: 4.5 V ~ 40 V
输出电压: 75V
安装类型: 表面贴装
封装/外壳: 16-TFSOP(0.118",3.00mm 宽)裸露焊盘
供应商设备封装: 16-MSOP,裸露焊盘
包装: 带卷 (TR)
工作温度: -40°C ~ 125°C
LT3755/LT3755-1/LT3755-2
APPLICATIONS INFORMATION
The inductor and output capacitor are chosen based on
performance, size and cost. The compensation resistor
and capacitor at VC are selected to optimize control loop
response and stability. For typical LED applications, a
2.2nF compensation capacitor at VC is adequate, and
a series resistor should always be used to increase the
slew rate on the VC pin to maintain tighter regulation of
LED current during fast transients on the input supply to
the converter.
Board Layout
The high speed operation of the LT3755 demands careful
attention to board layout and component placement. The
exposed pad of the package is the only GND terminal of
the IC and is also important for thermal management of
the IC. It is crucial to achieve a good electrical and thermal
contact between the exposed pad and the ground plane of
the board. To reduce electromagnetic interference (EMI), it
is important to minimize the area of the high dV/dt switching
node between the inductor, switch drain and anode of the
Schottky rectifier. Use a ground plane under the switching
20W SEPIC LED Driver
node to eliminate interplane coupling to sensitive signals.
The lengths of the high dI/dt traces: 1) from the switch
node through the switch and sense resistor to GND, and
2) from the switch node through the Schottky rectifier and
filter capacitor to GND should be minimized. The ground
points of these two switching current traces should come
to a common point then connect to the ground plane under
the LT3755. Likewise, the ground terminal of the bypass
capacitor for the INTV CC regulator should be placed near
the GND of the switching path. Typically this requirement
will result in the external switch being closest to the IC,
along with the INTV CC bypass capacitor. The ground for
the compensation network and other DC control signals
should be star connected to the underside of the IC. Do
not extensively route high impedance signals such as FB
and VC, as they may pick up switching noise. In particular,
avoid routing FB and PWMOUT in parallel for more than
a few millimeters on the board. Minimize resistance in
series with the SENSE input to avoid changes (most likely
reduction) to the switch current limit threshold.
V IN
8V TO
40V
C1
4.7μF
50V
1M
187k
V IN
SHDN /UVLO
V REF
FB
L1A
22μH
25k
511k
C4
2.2μF
50V
D1
5A
100V
L1B
C3
4.7μF
50V
100
95
V OUT = 18V
I LED = 1A
Efficiency vs V IN
INTV CC
CTRL
LT3755-2
ISP
0.1
1A
90
100k
ISN
OPENLED
GATE
M1
0.01μF
28.7k
375kHz
0.001μF
PWM
SS
RT
V C
30k
SENSE
PWMOUT
GND INTV CC
C2
4.7μF
10V
0.015
M2
20W
LED
STRING
85
80
0
10
20
V IN (V)
30
40
37551 TA04b
L1: WüRTH ELEKTRONIK 744870220
M1: VISHAY SILICONIX SI7454DP
D1: DIODES INC. - PDS5100
M2: VISHAY SILICONIX SI2318DS
37551 TA04a
37551fd
  
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