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参数资料
| 型号： | LT3991IMSE-5#PBF |
| 厂商： | Linear Technology |
| 文件页数： | 22/24页 |
| 文件大小： | 0K |
| 描述： | IC REG BUCK 5V 1.2A 10-MSOP |
| 标准包装： | 50 |
| 类型： | 降压（降压） |
| 输出类型： | 固定 |
| 输出数： | 1 |
| 输出电压： | 5V |
| 输入电压： | 4.3 V ~ 55 V |
| PWM 型： | 电流模式，混合 |
| 频率 - 开关： | 200kHz ~ 2MHz |
| 电流 - 输出： | 1.2A |
| 同步整流器： | 无 |
| 工作温度： | -40°C ~ 125°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 10-TFSOP，10-MSOP（0.118"，3.00mm 宽）裸露焊盘 |
| 包装： | 管件 |
| 供应商设备封装： | 10-MSOP 裸露焊盘 |
LT3991/LT3991-3.3/LT3991-5
PACKAGE DESCRIPTION
DD Package
10-Lead Plastic DFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1699 Rev C)
0.70 ± 0.05
R = 0.125
TYP
6
10
0.40 ± 0.10
0.00 – 0.05
3.55±0.05 1.65±0.05
2.15 ± 0.05 (2 SIDES)
0.25 ± 0.05
0.50
BSC
2.38 ± 0.05
(2 SIDES)
PACKAGE
OUTLINE
PIN 1
TOP MARK
(SEE NOTE 6)
0.200 REF
3.00 ± 0.10 1.65 ± 0.10
(4 SIDES) (2 SIDES) PIN 1 NOTCH
R = 0.20 OR
0.35 × 45 °
CHAMFER
(DD) DFN REV C 0310
5 1
0.75 ± 0.05 0.25 ± 0.05
0.50 BSC
2.38 ± 0.10
(2 SIDES)
BOTTOM VIEW—EXPOSED PAD
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-2).
CHECK THE LTC WEBSITE DATA SHEET FOR CURRENT STATUS OF VARIATION ASSIGNMENT
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
MSE Package
10-Lead Plastic MSOP, Exposed Die Pad
(Reference LTC DWG # 05-08-1664 Rev G)
BOTTOM VIEW OF
EXPOSED PAD OPTION
1.88 ± 0.102
(.074 ± .004)
0.889 ± 0.127
(.035 ± .005)
1
1.88
(.074)
1.68
0.29
REF
(.066)
5.23
(.206)
MIN
1.68 ± 0.102 3.20 – 3.45
(.066 ± .004) (.126 – .136)
0.05 REF
DETAIL “B”
CORNER TAIL IS PART OF
0.50
0.305 ± 0.038 (.0197)
(.0120 ± .0015) BSC
TYP
RECOMMENDED SOLDER PAD LAYOUT
3.00 ± 0.102
(.118 ± .004)
(NOTE 3)
10
10 9 8 7 6
DETAIL “B” THE LEADFRAME FEATURE.
FOR REFERENCE ONLY
NO MEASUREMENT PURPOSE
0.497 ± 0.076
(.0196 ± .003)
REF
0.254
(.010)
DETAIL “A”
0 ° – 6 ° TYP
4.90 ± 0.152
(.193 ± .006)
3.00 ± 0.102
(.118 ± .004)
(NOTE 4)
GAUGE PLANE
DETAIL “A”
0.53 ± 0.152
(.021 ± .006)
1.10
(.043)
MAX
1 2 3 4 5
0.86
(.034)
REF
0.18
(.007)
0.17 – 0.27
0.50
(.0197)
BSC
22
SEATING
PLANE
(.007 – .011)
TYP
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
6. EXPOSED PAD DIMENSION DOES NOT INCLUDE MOLD FLASH. MOLD FLASH ON E-PAD
SHALL NOT EXCEED 0.254mm (.010") PER SIDE.
0.1016 ± 0.0508
(.004 ± .002)
MSOP (MSE) 0910 REV G
3991fa
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