参数资料
型号: LT6301IFE
厂商: Linear Technology
文件页数: 7/16页
文件大小: 0K
描述: IC XDSL LINE DRIVER DUAL 28TSSOP
标准包装: 50
类型: 驱动器
驱动器/接收器数: 2/0
规程: xDSL
电源电压: 5 V ~ 12 V
安装类型: 表面贴装
封装/外壳: 28-SOIC(0.173",4.40mm 宽)裸露焊盘
供应商设备封装: 28-TSSOP 裸露焊盘
包装: 管件
产品目录页面: 1321 (CN2011-ZH PDF)
15
LT6301
sn6301 6301f
U
PACKAGE DESCRIPTIO
SI PLIFIED SCHE ATIC
WW
(one amplifier shown)
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
–IN
V+
Q1
Q5
R1
V
+IN
OUT
Q2
Q3
Q12
Q4
Q7
Q8
Q6
Q16
Q17
Q15
Q14
Q9
C2
C1
Q13
Q18
6301 SS
Q10
Q11
FE Package
28-Lead Plastic TSSOP (4.4mm)
(Reference LTC DWG # 05-08-1663)
Exposed Pad Variation EA
FE28 (EA) TSSOP 0203
0.09 – 0.20
(.0036 – .0079)
0
° – 8°
0.45 – 0.75
(.018 – .030)
4.30 – 4.50*
(.169 – .177)
6.40
BSC
13
4
5
6 7 89 10 11 12 13 14
19
20
22 21
15
16
18 17
9.60 – 9.80*
(.378 – .386)
7.56
(.298)
3.05
(.120)
28 2726 25 24 23
1.20
(.047)
MAX
0.05 – 0.15
(.002 – .006)
0.65
(.0256)
BSC
0.195 – 0.30
(.0077 – .0118)
2
RECOMMENDED SOLDER PAD LAYOUT
EXPOSED
PAD HEAT SINK
ON BOTTOM OF
PACKAGE
0.45
±0.05
0.65 BSC
4.50
±0.10
6.60
±0.10
1.05
±0.10
7.56
(.298)
3.05
(.120)
MILLIMETERS
(INCHES)
*DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED 0.150mm (.006") PER SIDE
NOTE:
1. CONTROLLING DIMENSION: MILLIMETERS
2. DIMENSIONS ARE IN
3. DRAWING NOT TO SCALE
SEE NOTE 4
4. RECOMMENDED MINIMUM PCB METAL SIZE
FOR EXPOSED PAD ATTACHMENT
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LT6301IFE#TR 功能描述:IC XDSL LINE DRIVER DUAL 28TSSOP RoHS:否 类别:集成电路 (IC) >> 接口 - 驱动器,接收器,收发器 系列:- 标准包装:250 系列:- 类型:收发器 驱动器/接收器数:2/2 规程:RS232 电源电压:3 V ~ 5.5 V 安装类型:表面贴装 封装/外壳:16-TSSOP(0.173",4.40mm 宽) 供应商设备封装:16-TSSOP 包装:带卷 (TR)
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