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参数资料
| 型号： | LTC1754ES6-5#TR |
| 厂商： | Linear Technology |
| 文件页数： | 8/12页 |
| 文件大小： | 0K |
| 描述： | IC REG SWITCHED CAP 5V SOT23-6 |
| 标准包装： | 2,500 |
| 类型： | 切换式电容器（充电泵） |
| 输出类型： | 固定 |
| 输出数： | 1 |
| 输出电压： | 5V |
| 输入电压： | 2.7 V ~ 5.5 V |
| PWM 型： | Burst Mode? |
| 频率 - 开关： | 700kHz |
| 电流 - 输出： | 50mA |
| 同步整流器： | 无 |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | SOT-23-6 |
| 包装： | 带卷 (TR) |
| 供应商设备封装： | SOT-23-6 |
LTC1754-3.3/LTC1754-5
APPLICATIO S I FOR ATIO
signal will keep V OUT in regulation under no-load condi-
tions. As the V OUT load current increases, the frequency
with which the LTC1754 is taken out of shutdown must
also be increased.
Layout Considerations
Due to high switching frequency and high transient cur-
rents produced by the LTC1754, careful board layout is
necessary. A true ground plane and short connections to
all capacitors will improve performance and ensure proper
V OUT
10 μ F
SHDN PIN
WAVEFORM
1
2
3
V OUT C +
LTC1754-X
GND V IN
SHDN C –
6
5
4
1 μ F
10 μ F
V IN
regulation under all conditions. Figure 4 shows the recom-
mended layout configuration
V IN
LOW I Q MODE (2Hz TO 100Hz, 2% TO 5% DUTY CYCLE)
1754 F02
V OUT
10 μ F
10 μ F
1 μ F
Figure 2. Ultralow Quiescent Current Regulated Supply
GND
LTC1754-X
SHDN
1754-5 F04
T A = 25 ° C
6
I OUT = 0 μ A
5 C FLY = 1 μ F
Figure 4. Recommended Layout
4
3
2
1
LTC1754-5
LTC1754-3.3
Thermal Management
For higher input voltages and maximum output current,
there can be substaintial power dissipation in the LTC1754.
If the junction temperature increases above approximately
150 ° C, the thermal shutdown circuitry will automatically
deactivate the output. To reduce the maximum junction
0
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
temperature, a good thermal connection to the PC board
is recommended. Connecting the GND pin (Pin 2) to a
SUPPLY VOLTAGE (V)
1754 F03
ground plane and maintaining a solid ground plane under
the device on at least two layers of the PC board can reduce
8
Figure 3. No-Load Supply Current vs Supply Voltage
for the Circuit Shown in Figure 2
the thermal resistance of the package and PC board
system to about 150 ° C/W.
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| LTC1755EGN | 功能描述:IC SMART CARD INTERFACE 24SSOP RoHS:否 类别:集成电路 (IC) >> 接口 - 专用 系列:- 特色产品:NXP - I2C Interface 标准包装:1 系列:- 应用:2 通道 I²C 多路复用器 接口:I²C，SM 总线 电源电压:2.3 V ~ 5.5 V 封装/外壳:16-TSSOP（0.173"，4.40mm 宽） 供应商设备封装:16-TSSOP 包装:剪切带 (CT) 安装类型:表面贴装 产品目录页面:825 (CN2011-ZH PDF) 其它名称:568-1854-1 |
| LTC1755EGN#PBF | 功能描述:IC SMART CARD INTERFACE 24SSOP RoHS:是 类别:集成电路 (IC) >> 接口 - 专用 系列:- 特色产品:NXP - I2C Interface 标准包装:1 系列:- 应用:2 通道 I²C 多路复用器 接口:I²C，SM 总线 电源电压:2.3 V ~ 5.5 V 封装/外壳:16-TSSOP（0.173"，4.40mm 宽） 供应商设备封装:16-TSSOP 包装:剪切带 (CT) 安装类型:表面贴装 产品目录页面:825 (CN2011-ZH PDF) 其它名称:568-1854-1 |
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