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参数资料
| 型号： | LTC2171IUKG-14#TRPBF |
| 厂商： | Linear Technology |
| 文件页数： | 21/34页 |
| 文件大小： | 0K |
| 描述： | IC ADC 14BIT SER/PAR 40M 52-QFN |
| 标准包装： | 2,000 |
| 位数： | 14 |
| 采样率（每秒）： | 45M |
| 数据接口： | Serial LVDS |
| 转换器数目： | 4 |
| 功率耗散（最大）： | 293mW |
| 电压电源： | 模拟和数字 |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 52-WFQFN 裸露焊盘 |
| 供应商设备封装： | 52-QFN（7x8） |
| 包装： | 带卷 (TR) |
| 输入数目和类型： | 2 Differential; 2 Single-Ended |
| 配用： | DC1371A-ND - BOARD USB DATA ACQUISITION HS |
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LTC2172-14/
LTC2171-14/LTC2170-14
28
21721014fb
applicaTions inForMaTion
GROUNDING AND BYPASSING
The LTC2172-14/LTC2171-14/LTC2170-14 requires a
printed circuit board with a clean unbroken ground plane.
A multilayer board with an internal ground plane in the
first layer beneath the ADC is recommended. Layout for
the printed circuit board should ensure that digital and
analog signal lines are separated as much as possible. In
particular, care should be taken not to run any digital track
alongside an analog signal track or underneath the ADC.
High quality ceramic bypass capacitors should be used at
the VDD, OVDD, VCM, VREF, REFH and REFL pins. Bypass
capacitorsmustbelocatedasclosetothepinsaspossible.
Of particular importance is the 0.1F capacitor between
REFH and REFL. This capacitor should be on the same
side of the circuit board as the A/D, and as close to the
device as possible (1.5mm or less). Size 0402 ceramic
capacitors are recommended. The larger 2.2F capacitor
between REFH and REFL can be somewhat further away.
Thetracesconnectingthepinsandbypasscapacitorsmust
be kept short and should be made as wide as possible.
The analog inputs, encode signals and digital outputs
should not be routed next to each other. Ground fill and
grounded vias should be used as barriers to isolate these
signals from each other.
HEAT TRANSFER
MostoftheheatgeneratedbytheLTC2172-14/LTC2171-14/
LTC2170-14istransferredfromthediethroughthebottom-
sideexposedpadandpackageleadsontotheprintedcircuit
board. For good electrical and thermal performance, the
exposed pad must be soldered to a large grounded pad
on the PC board. This pad should be connected to the
internal ground planes by an array of vias.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| LTC2172-12 | 制造商:LINER 制造商全称:Linear Technology 功能描述:12-Bit, 65Msps/40Msps/25Msps Low Power Quad ADCs |
| LTC2172-14 | 制造商:LINER 制造商全称:Linear Technology 功能描述:Quad 14-Bit, 125Msps ADC with Integrated Drivers |
| LTC2172CUKG-12#PBF | 功能描述:IC ADC 12BIT SER/PAR 65M 52-QFN RoHS:是 类别:集成电路 (IC) >> 数据采集 - 模数转换器 系列:- 其它有关文件:TSA1204 View All Specifications 标准包装:1 系列:- 位数:12 采样率（每秒）:20M 数据接口:并联 转换器数目:2 功率耗散（最大）:155mW 电压电源:模拟和数字 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:48-TQFP 供应商设备封装:48-TQFP（7x7） 包装:Digi-Reel® 输入数目和类型:4 个单端，单极；2 个差分，单极 产品目录页面:1156 (CN2011-ZH PDF) 其它名称:497-5435-6 |
| LTC2172CUKG-12#TRPBF | 功能描述:IC ADC 12BIT SER/PAR 65M 52-QFN RoHS:是 类别:集成电路 (IC) >> 数据采集 - 模数转换器 系列:- 标准包装:1 系列:- 位数:14 采样率（每秒）:83k 数据接口:串行，并联 转换器数目:1 功率耗散（最大）:95mW 电压电源:双 ± 工作温度:0°C ~ 70°C 安装类型:通孔 封装/外壳:28-DIP（0.600"，15.24mm） 供应商设备封装:28-PDIP 包装:管件 输入数目和类型:1 个单端，双极 |
| LTC2172CUKG-12PBF | 制造商:LINER 制造商全称:Linear Technology 功能描述:12-Bit, 65Msps/40Msps/25Msps Low Power Quad ADCs |
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