参数资料
型号: LTC2237IUH#TRPBF
厂商: Linear Technology
文件页数: 20/28页
文件大小: 0K
描述: IC ADC 10BIT 40MSPS 3V 32-QFN
标准包装: 2,500
位数: 10
采样率(每秒): 40M
数据接口: 并联
转换器数目: 1
功率耗散(最大): 144mW
电压电源: 单电源
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 32-WFQFN 裸露焊盘
供应商设备封装: 32-QFN 裸露焊盘(5x5)
包装: 带卷 (TR)
输入数目和类型: 1 个单端,双极; 1 个差分,双极
LTC2238/LTC2237/LTC2236
27
223876fa
UH Package
32-Lead Plastic QFN (5mm
× 5mm)
(Reference LTC DWG # 05-08-1693)
PACKAGE DESCRIPTIO
U
5.00
± 0.10
(4 SIDES)
NOTE:
1. DRAWING PROPOSED TO BE A JEDEC PACKAGE OUTLINE
M0-220 VARIATION WHHD-(X) (TO BE APPROVED)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
PIN 1
TOP MARK
(NOTE 6)
0.40
± 0.10
0.23 TYP
(4 SIDES)
31
1
2
32
BOTTOM VIEW—EXPOSED PAD
3.45
± 0.10
(4-SIDES)
0.75
± 0.05
R = 0.115
TYP
0.25
± 0.05
(UH) QFN 0603
0.50 BSC
0.200 REF
0.00 – 0.05
0.70
±0.05
3.45
±0.05
(4 SIDES)
4.10
±0.05
5.50
±0.05
0.25
± 0.05
PACKAGE OUTLINE
0.50 BSC
RECOMMENDED SOLDER PAD LAYOUT
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
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