参数资料
型号: LTC2266CUJ-14#PBF
厂商: Linear Technology
文件页数: 20/32页
文件大小: 0K
描述: IC ADC 14BIT SER 80MSPS 40-QFN
标准包装: 61
位数: 14
采样率(每秒): 80M
数据接口: Serial LVDS
转换器数目: 2
功率耗散(最大): 257mW
电压电源: 单电源
工作温度: 0°C ~ 70°C
安装类型: 表面贴装
封装/外壳: 40-WFQFN 裸露焊盘
供应商设备封装: 40-QFN(6x6)
包装: 管件
输入数目和类型: 2 Differential; 2 Single-Ended
配用: DC1371A-ND - BOARD USB DATA ACQUISITION HS
LTC2268-14/
LTC2267-14/LTC2266-14
27
22687614fa
applicaTions inForMaTion
GROUNDING AND BYPASSING
The LTC2268-14/LTC2267-14/LTC2266-14 requires a
printed circuit board with a clean unbroken ground plane.
A multilayer board with an internal ground plane in the
first layer beneath the ADC is recommended. Layout for
the printed circuit board should ensure that digital and
analog signal lines are separated as much as possible. In
particular, care should be taken not to run any digital track
alongside an analog signal track or underneath the ADC.
High quality ceramic bypass capacitors should be used at
the VDD, OVDD, VCM, VREF, REFH and REFL pins. Bypass
capacitorsmustbelocatedasclosetothepinsaspossible.
Of particular importance is the 0.1F capacitor between
REFH and REFL. This capacitor should be on the same
side of the circuit board as the A/D, and as close to the
device as possible (1.5mm or less). Size 0402 ceramic
capacitors are recommended. The larger 2.2F capacitor
between REFH and REFL can be somewhat further away.
Thetracesconnectingthepinsandbypasscapacitorsmust
be kept short and should be made as wide as possible.
The analog inputs, encode signals, and digital outputs
should not be routed next to each other. Ground fill and
grounded vias should be used as barriers to isolate these
signals from each other.
HEAT TRANSFER
MostoftheheatgeneratedbytheLTC2268-14/LTC2267-14/
LTC2266-14 is transferred from the die through the
bottom-side Exposed Pad and package leads onto the
printed circuit board. For good electrical and thermal
performance, the Exposed Pad must be soldered to a large
grounded pad on the PC board. This pad should be con-
nected to the internal ground planes by an array of vias.
Typical applicaTions
Silkscreen Top
Top Side
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