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参数资料
| 型号： | LTC2268IUJ-14#TRPBF |
| 厂商： | Linear Technology |
| 文件页数： | 20/32页 |
| 文件大小： | 0K |
| 描述： | IC ADC 14BIT 125MSPS DUAL 40QFN |
| 标准包装： | 2,000 |
| 位数： | 14 |
| 采样率（每秒）： | 125M |
| 数据接口： | Serial LVDS |
| 转换器数目： | 2 |
| 功率耗散（最大）： | 364mW |
| 电压电源： | 单电源 |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 40-WFQFN 裸露焊盘 |
| 供应商设备封装： | 40-QFN（6x6） |
| 包装： | 带卷 (TR) |
| 输入数目和类型： | 2 Differential; 2 Single-Ended |
| 配用： | DC1371A-ND - BOARD USB DATA ACQUISITION HS |
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LTC2268-14/
LTC2267-14/LTC2266-14
27
22687614fa
applicaTions inForMaTion
GROUNDING AND BYPASSING
The LTC2268-14/LTC2267-14/LTC2266-14 requires a
printed circuit board with a clean unbroken ground plane.
A multilayer board with an internal ground plane in the
first layer beneath the ADC is recommended. Layout for
the printed circuit board should ensure that digital and
analog signal lines are separated as much as possible. In
particular, care should be taken not to run any digital track
alongside an analog signal track or underneath the ADC.
High quality ceramic bypass capacitors should be used at
the VDD, OVDD, VCM, VREF, REFH and REFL pins. Bypass
capacitorsmustbelocatedasclosetothepinsaspossible.
Of particular importance is the 0.1F capacitor between
REFH and REFL. This capacitor should be on the same
side of the circuit board as the A/D, and as close to the
device as possible (1.5mm or less). Size 0402 ceramic
capacitors are recommended. The larger 2.2F capacitor
between REFH and REFL can be somewhat further away.
Thetracesconnectingthepinsandbypasscapacitorsmust
be kept short and should be made as wide as possible.
The analog inputs, encode signals, and digital outputs
should not be routed next to each other. Ground fill and
grounded vias should be used as barriers to isolate these
signals from each other.
HEAT TRANSFER
MostoftheheatgeneratedbytheLTC2268-14/LTC2267-14/
LTC2266-14 is transferred from the die through the
bottom-side Exposed Pad and package leads onto the
printed circuit board. For good electrical and thermal
performance, the Exposed Pad must be soldered to a large
grounded pad on the PC board. This pad should be con-
nected to the internal ground planes by an array of vias.
Typical applicaTions
Silkscreen Top
Top Side
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相关代理商/技术参数 |
参数描述 |
|---|---|
| LTC2269 | 制造商:LINER 制造商全称:Linear Technology 功能描述:16-Bit, 20Msps Low Noise ADC |
| LTC2269CUK#PBF | 制造商:Linear Technology 功能描述:ADC Single 20Msps 16-bit Parallel/Serial (SPI)/LVDS 48-Pin QFN EP 制造商:Linear Technology 功能描述:IC ADC 16BIT 20MSPS 48-QFN 制造商:Linear Technology 功能描述:ADC 16BIT 1.8V 20MSPS 48QF 制造商:Linear Technology 功能描述:ADC, 16BIT, 1.8V, 20MSPS, 48QFN 制造商:Linear Technology 功能描述:ADC, 16BIT, 20MSPS, PARALLEL, SERIAL, QFN-48; Resolution (Bits):16bit; Sampling Rate:20MSPS; Supply Voltage Type:Single; Supply Voltage Min:1.7V; Supply Voltage Max:1.9V; Supply Current:48.9mA; Digital IC Case Style:QFN; DNL:0.2LSB ;RoHS Compliant: Yes |
| LTC2269CUK#TRPBF | 制造商:Linear Technology 功能描述:ADC Single 20Msps 16-bit Parallel/Serial (SPI)/LVDS 48-Pin QFN EP T/R 制造商:Linear Technology 功能描述:IC ADC 16BIT 20MSPS 48-QFN |
| LTC2269IUK#PBF | 制造商:Linear Technology 功能描述:ADC Single 20Msps 16-bit Parallel/Serial (SPI)/LVDS 48-Pin QFN EP 制造商:Linear Technology 功能描述:IC ADC 16BIT 20MSPS 48-QFN 制造商:Linear Technology 功能描述:ADC 16BIT 1.8V 20MSPS 48QF 制造商:Linear Technology 功能描述:ADC, 16BIT, 1.8V, 20MSPS, 48QFN 制造商:Linear Technology 功能描述:ADC, 16BIT, 20MSPS, PARALLEL, SERIAL, QFN-48; Resolution (Bits):16bit; Sampling Rate:20MSPS; Supply Voltage Type:Single; Supply Voltage Min:1.7V; Supply Voltage Max:1.9V; Supply Current:48.9mA; Digital IC Case Style:QFN; DNL:0.2LSB ;RoHS Compliant: Yes |
| LTC2269IUK#TRPBF | 制造商:Linear Technology 功能描述:ADC Single 20Msps 16-bit Parallel/Serial (SPI)/LVDS 48-Pin QFN EP T/R 制造商:Linear Technology 功能描述:IC ADC 16BIT 20MSPS 48-QFN |
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