参数资料
| 型号： | LTC2450IDC#TRPBF |
| 厂商： | Linear Technology |
| 文件页数： | 8/20页 |
| 文件大小： | 0K |
| 描述： | IC ADC 16BIT DELTA SIG 6-DFN |
| 标准包装： | 2,500 |
| 位数： | 16 |
| 采样率（每秒）： | 30 |
| 数据接口： | 串行，SPI? |
| 转换器数目： | 1 |
| 功率耗散（最大）： | 1.05mW |
| 电压电源： | 单电源 |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 6-WFDFN 裸露焊盘 |
| 供应商设备封装： | 6-DFN-EP（2x2） |
| 包装： | 带卷 (TR) |
| 输入数目和类型： | 1 个单端，单极 |
| 配用： | DC1067A-B-ND - BOARD DELTA SIGMA ADC LTC2450-1 DC1067A-A-ND - BOARD DELTA SIGMA ADC LTC2450 |
LTC2450
16
2450fb
APPLICATIONS INFORMATION
Figure 16. Measured INL vs Input Voltage,
CIN = 0.1μF, VCC = 5V, TA = 25°C
For most applications, it is desirable to implement CIN as
a high quality 0.1μF ceramic capacitor and RS ≤ 1k. This
capacitor should be located as close as possible to the
actual VINpackagepin.Furthermoretheareaencompassed
by this circuit path as well as the path length should be
minimized.
In the case of a 2-wire sensor which is not remotely
grounded, it is desirable to split RS and place series
resistors in the ADC input line as well as in the sensor
ground return line which should be tied to the ADC GND
pin using a star connection topology.
Figure 16 shows the measured LTC2450 INL vs In-
put Voltage as a function of RS value with an input
capacitor CIN = 0.1μF.
In some cases, RScanbeincreasedabovetheseguidelines.
In the case of the LTC2450, in the rst half of the CONVERT
state, the internal calibration algorithm maintains IAV
strictly at zero. Each half of the CONVERT state is about
16.67ms. Additionally, the input current is zero while the
ADC is either in sleep or I/O modes. Thus, if the time
constant of the input R-C circuit τ = RS CIN is of the
same order magnitude or longer than the time periods
between actual conversions, then one can consider the
input current to be reduced correspondingly.
These considerations need to be balanced out by the input
signal bandwidth. The 3dB bandwidth 1/(2π RS CIN).
Finally, if the recommended choice for CIN is unacceptable
for the user’s specic application, an alternate strategy is to
eliminate CIN and minimize CPAR and RS. In practical terms,
this conguration corresponds to a low impedance sensor
directly connected to the ADC through minimum length
traces. Actual applications include current measurements
through low value sense resistors, temperature measure-
ments, low impedance voltage source monitoring and so
on. The resultant INL vs VIN is shown in Figure 17. The
measurements of Figure 17 include a CPAR capacitor cor-
responding to a minimum size layout pad and a minimum
width input trace of about 1 inch length.
Figure 17. Measured INL vs VIN, CIN = 0, VCC = 5V, TA = 25°C
INPUT VOLTAGE (V)
0
INL(LSB)
–4
0
4
3
5
2450 F16
–8
–12
–16
12
4
8
12
16
RS = 10k
RS = 1k
RS = 0
INPUT VOLTAGE (V)
0
INL
(LSB)
8
6
4
2
0
–2
–4
–6
–8
4
2450 F17
123
5
3.5
0.5
1.5
2.5
4.5
RS = 1k
RS = 10k
RS = 0
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