参数资料
型号: LTC3100EUD#PBF
厂商: Linear Technology
文件页数: 17/26页
文件大小: 403K
描述: IC REG BUCK/BOOST/LINEAR 16-QFN
产品培训模块: More Information on LDOs
标准包装: 121
拓扑: 降压(降压)(1),升压(升压)(1),线性(LDO)(1)
功能: 任何功能
输出数: 3
频率 - 开关: 1.5MHz
电压/电流 - 输出 1: 0.6 V ~ 5.5 V,250mA
电压/电流 - 输出 2: 1.5 V ~ 5.25 V,700mA
电压/电流 - 输出 3: 0.6 V ~ 5.25 V,100mA
带 LED 驱动器:
带监控器:
带序列发生器:
电源电压: 0.5 V ~ 5.5 V
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 16-WFQFN 裸露焊盘
供应商设备封装: 16-QFN-EP(3x3)
包装: 管件
LTC3100
17
3100fb
For more information www.linear.com/LTC3100
PC Board Layout Guidelines
The LTC3100 switches large currents at high frequen-
cies. Special care should be given to the PC board layout
to ensure stable, noise-free operation. You will not get
advertised performance with a careless layout. Figure 1
depicts the recommended PC board layout. A large ground
pin copper area will help to lower the chip temperature.
A multilayer board with a separate ground plane is ideal,
but not absolutely necessary.
A few key guidelines follow:
1. All circulating high current paths should be kept as
short as possible. Capacitor ground connections should
via down to the ground plane in the shortest route
possible. The bypass capacitors on all V
IN
 and V
OUT
 
APPLICATIONS INFORMATION
Figure 1. Recommended Component Placement for Two-Layer PC Board
pins should be placed as close to the IC as possible
and should have the shortest possible paths to ground.
2. To prevent large circulating currents from disrupting the
output voltage sensing, the ground for each resistor
divider should be returned directly to the ground plane
near the IC.
3. Use of vias in the die attach pad of the IC will enhance
the thermal environment of the converter, especially if
the vias extend to a ground plane region on the exposed
bottom surface of the PC board.
4. Keep the connection from the resistor dividers to the
feedback pins as short as possible and away from the
switch pin connections.
16
LTC3100
3100 F01
15  14  13
5   6
8
7
12
11
10
9
1
2
3
4
FBBST
SWBST
V
BST
V
LDO
V
BUCK
SWBK
FBLDO
RUNLDO
FBBK
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LTC3101EUF#PBF 功能描述:IC BUCK/BST TRPL ADJ 350MA 24QFN RoHS:是 类别:集成电路 (IC) >> PMIC - 电源管理 - 专用 系列:PowerPath™ 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:50 系列:- 应用:热电冷却器 电流 - 电源:- 电源电压:3 V ~ 5.5 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:28-SOIC(0.173",4.40mm 宽)裸露焊盘 供应商设备封装:28-TSSOP 裸露焊盘 包装:管件 产品目录页面:1410 (CN2011-ZH PDF)
LTC3101EUF#TRPBF 功能描述:IC BUCK/BST TRPL ADJ 350MA 24QFN RoHS:是 类别:集成电路 (IC) >> PMIC - 电源管理 - 专用 系列:PowerPath™ 标准包装:1 系列:- 应用:手持/移动设备 电流 - 电源:- 电源电压:3 V ~ 5.5 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:14-WFDFN 裸露焊盘 供应商设备封装:14-LLP-EP(4x4) 包装:Digi-Reel® 配用:LP3905SD-30EV-ND - BOARD EVALUATION LP3905SD-30 其它名称:LP3905SD-30DKR