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参数资料
| 型号： | LTC3125EDCB#TRPBF |
| 厂商： | Linear Technology |
| 文件页数： | 3/18页 |
| 文件大小： | 0K |
| 描述： | IC REG BOOST SYNC ADJ 1.2A 8DFN |
| 标准包装： | 2,500 |
| 类型： | 升压（升压） |
| 输出类型： | 可调式 |
| 输出数： | 1 |
| 输出电压： | 2 V ~ 5.25 V |
| 输入电压： | 1.8 V ~ 5.5 V |
| PWM 型： | 电流模式，混合 |
| 频率 - 开关： | 1.6MHz |
| 电流 - 输出： | 1.2A |
| 同步整流器： | 是 |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 8-WFDFN 裸露焊盘 |
| 包装： | 带卷 (TR) |
| 供应商设备封装： | 8-DFN（3x2） |
LTC3125
ELECTRICAL CHARACTERISTICS The l denotes the speci?cations which apply over the full operating
junction temperature range, otherwise speci?cations are at T A = 25°C. V IN = 3.3V, V OUT = 4.5V unless otherwise noted (Note 2).
PARAMETER
PROG Current Gain
CONDITIONS
(Note 3)
MIN
TYP
22.1
MAX
UNITS
kΩ-A/A
Maximum Duty Cycle
Minimum Duty Cycle
V FB = 1.15V
V FB = 1.3V
l
l
85
92
0
%
%
Frequency
l
1.3
1.6
1.9
MHz
SHDN Input High
SHDN Input Low
1
0.35
V
V
SHDN Input Current
V SHDN = 1.2V
0.3
1
μA
Note 1: Stresses beyond those listed under Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to any Absolute
Maximum Rating condition for extended periods may affect device
reliability and lifetime.
Note 2: The LTC3125 is tested under pulsed load conditions such that
T J ≈ T A . The LTC3125E (E Grade) is guaranteed to meet speci?cations
from 0°C to 85°C junction temperature. Speci?cations over the –40°C
to 125°C operating junction temperature range are assured by design,
characterization and correlation with statistical process controls. The
junction temperature (T J ) is calculated from the ambient temperature
(T A ) and power dissipation (P D ) according to the formula: T J = T A + (P D )
( θ JA °C/W), where θ JA is the package thermal impedance. The maximum
ambient temperature consistent with these speci?cations is determined by
speci?c operating conditions in conjunction with board layout, the rated
package thermal resistance and other environmental factors.
Note 3: Speci?cation is guaranteed by design and not 100% tested in
production.
Note 4: Current measurements are made when the output is not switching.
Note 5: This IC includes overtemperature protection that is intended
to protect the device during momentary overload conditions. Junction
temperature will exceed 125°C when overtemperature protection is active.
Continuous operation above the speci?ed maximum operating junction
temperature may result in device degradation or failure.
Note 6: Failure to solder the exposed backside of the package to the PC
board ground plane will result in a thermal resistance much higher than
60°C/W.
TYPICAL PERFORMANCE CHARACTERISTICS (T A = 25°C unless otherwise noted)
Ef?ciency vs Load Current,
V OUT = 2.5V
Ef?ciency vs Load Current,
V OUT = 3.3V
100
90
80
70
60
50
40
1
0.1
0.01
100
90
80
70
60
50
40
1
0.1
30
20
10
0
0.001
0.01 0.1
V IN = 2.1V
V IN = 1.8V
1
0.001
0.0001
30
20
10
0
0.001
0.01 0.1
V IN = 2.8V
V IN = 2.4V
V IN = 2V
1
0.01
0.001
LOAD CURRENT (A)
3125 G01
LOAD CURRENT (A)
3125 G02
3125fa
3
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