参数资料
型号: LTC3200EMS8#TRPBF
厂商: Linear Technology
文件页数: 9/12页
文件大小: 0K
描述: IC REG SWITCHED CAP DBL 8MSOP
标准包装: 2,500
类型: 切换式电容器(充电泵),倍增器
输出数: 1
输入电压: 2.7 V ~ 4.5 V
频率 - 开关: 2MHz
电流 - 输出: 100mA
同步整流器:
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 8-TSSOP,8-MSOP(0.118",3.00mm 宽)
包装: 带卷 (TR)
供应商设备封装: 8-MSOP
LTC3200/LTC3200-5
OPERATIO
P OUT
η ≡ = = OUT
Power Efficiency
The power efficiency ( η ) of the LTC3200/LTC3200-5 is
similar to that of a linear regulator with an effective input
voltage of twice the actual input voltage. This occurs
because the input current for a voltage doubling charge
pump is approximately twice the output current. In an ideal
regulating voltage doubler the power efficiency would be
given by:
V OUT ? I OUT V
P IN V IN ? 2 I OUT 2 V IN
At moderate to high output power the switching losses
and quiescent current of the LTC3200/LTC3200-5 are
negligible and the expression above is valid. For example
with V IN = 3V, I OUT = 50mA and V OUT regulating to 5V the
measured efficiency is 80% which is in close agreement
with the theoretical 83.3% calculation.
Operation at V IN > 5V
LTC3200/LTC3200-5 will continue to operate with input
voltages somewhat above 5V. However, because of its
constant frequency nature, some charge due to internal
switching will be coupled to V OUT causing a slight upward
movement of the output voltage at very light loads. To
avoid an output overvoltage problem with high V IN , a
moderate standing load current of 1mA will help the
LTC3200/LTC3200-5 maintain exceptional line regula-
Layout Considerations
Due to its high switching frequency and the high transient
currents produced by the LTC3200/LTC3200-5, careful
board layout is necessary. A true ground plane and short
connections to all capacitors will improve performance and
ensure proper regulation under all conditions. Figure 5
shows an example layout for the LTC3200-5.
Thermal Management
For higher input voltages and maximum output current
there can be substantial power dissipation in the LTC3200/
LTC3200-5. If the junction temperature increases above
approximately 160 ° C the thermal shutdown circuitry will
automatically deactivate the output. To reduce the
maximum junction temperature, a good thermal connec-
tion to the PC board is recommended. Connecting the
GND pin (Pins 4/5 for LTC3200, Pin 2 for LTC3200-5) to
a ground plane, and maintaining a solid ground plane
under the device on two layers of the PC board can reduce
the thermal resistance of the package and PC board
considerably.
Derating Power at Higher Temperatures
To prevent an overtemperature condition in high power
applications Figure 6 should be used to determine the
maximum combination of ambient temperature and power
dissipation.
tion. This can be achieved with a 5k resistor from V OUT to
GND.
V IN
V OUT
1.2
1.0
0.8
0.6
θ JA = 175 ° C/W
T J = 160 ° C
GND
1 μ F
1 μ F
1 μ F
0.4
0.2
SHDN
LTC3200-5
0
–50
–25
0 25 50
75
100
Figure 5. Recommended Layout
32005 F03
AMBIENT TEMPERATURE ( ° C)
32005 ? F06
Figure 6. Maximum Power Dissipation
vs Ambient Temperature
9
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