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参数资料
| 型号： | LTC3215EDD#TR |
| 厂商： | Linear Technology |
| 文件页数： | 5/14页 |
| 文件大小： | 0K |
| 描述： | IC LED DRIVR WHITE BCKLGT 10-DFN |
| 标准包装： | 2,500 |
| 拓扑： | PWM，升压（升压），切换式电容器（充电泵） |
| 输出数： | 1 |
| 内部驱动器： | 是 |
| 类型 - 主要： | 背光，闪灯/白光 |
| 类型 - 次要： | 白色 LED |
| 频率： | 600kHz ~ 1.2MHz |
| 电源电压： | 2.9 V ~ 4.4 V |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 10-WFDFN 裸露焊盘 |
| 供应商设备封装： | 10-DFN（3x3） |
| 包装： | 带卷 (TR) |
| 工作温度： | -40°C ~ 85°C |
LTC3215
TYPICAL PERFORMANCE CHARACTERISTICS
(T A = 25°C unless otherwise specified)
V CPO
1V/DIV
Charge Pump Mode Switching
and Input Current (I LED = 400mA)
100
90
80
Efficiency vs V IN
3400
3350
I SET /I LED Current Ratio
vs I LED Current
I VIN
500mA/
DIV
EN2
5V/DIV
V IN = 3V
1ms/DIV
3215 G12
70
60
50
40
30
20
10
0
100mA
200mA
400mA
AOT2015
V F = 3V TYP AT 200mA
2.8 3.0 3.2 3.4 3.6
3.8
4.0
4.2
4.4
3300
3250
3200
3150
3100
0
25 ° C
–40 ° C
85 ° C
200 400
600
800
PIN FUNCTIONS
V IN (V)
3215 G13
I LED CURRENT (mA)
3215 G14
C2 + , C1 + , C2 – , C1 – (Pins 1, 2, 8, 10): Charge Pump
Flying Capacitor Pins. A 2.2μF X5R or X7R ceramic ca-
pacitor should be connected from C1 + to C1 – and from
C2 + to C2 – .
CPO (Pin 3): Output. CPO is the output of the Charge
Pump. This pin may be enabled or disabled using the EN
input. A 4.7μF X5R or X7R ceramic capacitor is required
from CPO to GND.
I LED (Pin 4): Output. I LED is the LED current source
output. The LED is connected between CPO (anode) and
I LED (cathode). The current into the I LED pin is set by the
programming resistor connected from I SET to GND.
I SET (Pin 5): LED Current Programming Resistor Pin. The
I SET pin will servo to 1.22V. A resistor connected between
this pin and GND is used to set the LED current level. Con-
necting a resistor of 2k or less will cause the LTC3215 to
enter overcurrent shutdown mode.
EN (Pin 6): Input. The EN is used to enable the part or put
it into shutdown mode.
V IN (Pin 7): Power. Supply voltage for the LTC3215. V IN
should be bypassed with a 2.2μF or greater low impedance
ceramic capacitor to GND.
GND (Pin 9): Charge Pump Ground. This pin should be
connected directly to a low impedance ground plane.
EXPOSED PAD (Pin 11): Control Signal Ground. This pad
must be soldered to a low impedance ground plane for
optimum thermal and electrical performance.
3215fc
5
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