参数资料
型号: LTC3250ES6-1.5#TRPBF
厂商: Linear Technology
文件页数: 9/12页
文件大小: 0K
描述: IC REG BUCK 1.5V 0.25A SOT23-6
标准包装: 2,500
类型: 降压(降压)
输出类型: 固定
输出数: 1
输出电压: 1.5V
输入电压: 3.1 V ~ 5.5 V
PWM 型: Burst Mode?
频率 - 开关: 1.5MHz
电流 - 输出: 250mA
同步整流器:
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: SOT-23-6
包装: 带卷 (TR)
供应商设备封装: SOT-23-6
LTC3250-1.5/LTC3250-1.2
OPERATIO
(Refer to Simplified Block Diagram)
P D = ? IN – V OUT ? I OUT
Thermal Management
For higher input voltages and maximum output current
there can be substantial power dissipation in the
LTC3250-1.5/LTC3250-1.2. If the junction temperature
increases above approximately 160 ° C the thermal shut-
down circuitry will automatically deactivate the output. To
reduce the maximum junction temperature, a good ther-
mal connection to the PC board is recommended. Con-
necting the GND pin (Pin 2) to a ground plane, and
maintaining a solid ground plane under the device can
reduce the thermal resistance of the package and PC board
considerably.
Derating Power at Higher Temperatures
To prevent an overtemperature condition in high power
applications Figure 3 should be used to determine the
maximum combination of ambient temperature and power
1.2
1.0
0.8
0.6
0.4
0.2
dissipation. The power dissipated in the LTC3250-1.5/
LTC3250-1.2 should always fall under the line shown (i.e.
within the safe region) for a given ambient temperature.
The power dissipated in the LTC3250-1.5/LTC3250-1.2 is
given by the expression:
? V ?
? 2 ?
This derating curve assumes a maximum thermal resis-
tance, θ JA , of 175 ° C/W for the 6-pin ThinSOT-23. This
thermal resistances can be achieved from a printed circuit
board layout with a solid ground plane (2000mm 2 )on at
least one layer with a good thermal connection to the
ground pin of the LTC3250-1.5/LTC3250-1.2. Operation
outside of this curve will cause the junction temperature to
exceed 140 ° C which may trigger the thermal shutdown
circuitry and ultimately reduce the life of the device.
θ JA = 175 ° C/W
T J = 140 ° C
0
–50
–25
0 25 50
75
100
AMBIENT TEMPERATURE ( ° C)
3250 ? F03
Figure 3. Maximum Power Dissipation vs Ambient Temperature
3250fa
9
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