参数资料
型号: LTC3427EDC#TRPBF
厂商: Linear Technology
文件页数: 8/12页
文件大小: 0K
描述: IC REG BOOST SYNC ADJ 0.5A 6DFN
标准包装: 2,500
类型: 升压(升压)
输出类型: 可调式
输出数: 1
输出电压: 1.8 V ~ 5.25 V
输入电压: 1.8 V ~ 5 V
PWM 型: 电流模式
频率 - 开关: 1.25MHz
电流 - 输出: 500mA
同步整流器:
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 6-WFDFN 裸露焊盘
包装: 带卷 (TR)
供应商设备封装: 6-DFN-EP(2x2)
LTC3427
APPLICATIO S I FOR ATIO
Table 1. Inductor Vendor Information
SUPPLIER
Murata
PHONE
USA: (814) 237-1431
FAX
USA: (814) 238-0490
WEBSITE
www.murata.com
(800) 831-9172
Sumida
Coilcraft
CoEv Magnetics
TDK
TOKO
Wurth
USA: (847) 956-0666
Japan: 81-3-3607-5111
(847) 639-6400
(800) 227-7040
(847) 803-6100
(847) 297-0070
(201) 785-8800
USA: (847) 956-0702
Japan: 81-3-3607-5144
(847) 639-1469
(650) 361-2508
(847) 803-6296
(847) 669-7864
(201) 785-8810
www.sumida.com
www.coilcraft.com
www.circuitprotection.com/magnetics.asp
www.component.tdk.com
www.toko.com
www.we-online.com
0.280
Table 2. Capacitor Vendor Information
0.260
0.240
0.220
1.8V TO 3V
3.1V TO 5V
1.8V TO 3.3V
SUPPLIER PHONE
AVX (803) 448-9411
Sanyo
(619) 661-6322
FAX
(803) 448-1943
(619) 661-1055
WEBSITE
www.avxcorp.com
www.sanyovideo.com
0.200
1.8V TO 3.6V
0.180
0.160
0.140
0.120
1.8V TO 5V
TDK
Murata
(847) 803-6100
USA:
(814) 237-1431
(800) 831-9172
(847) 803-629
USA:
(814) 238-0490
www.component.
tdk.com
www.murata.com
0.100
3
5
7
9 11 13 15 17 19 21 23
Taiyo
(408) 573-4150
(408) 573-4159
www.t-yuden.com
INDUCTANCE ( μ H)
3427 F02
Yuden
Figure 2. Maximum Output Current vs
Inductance Based on 90% Efficiency
Low ESR input capacitors reduce input switching noise
and reduce the peak current drawn from the battery. It
follows that ceramic capacitors are also a good choice for
input decoupling and should be located as close as pos-
sible to the device. A 2.2 μ F input capacitor is sufficient for
virtually any application. Larger values may be used with-
out limitations. Table 2 shows a list of several ceramic
capacitor manufacturers. Consult the manufacturers di-
rectly for detailed information on their entire selection of
ceramic capacitors.
Thermal Considerations
To deliver the power that the LTC3427 is capable of, it is
imperative that a good thermal path be provided to dissi-
pate the heat generated within the package. This can be
accomplished by taking advantage of the large thermal
pad on the underside of the LTC3427. It is recommended
that multiple vias in the printed circuit board be used to
conduct heat away from the LTC3427 and into the copper
plane with as much area as possible. In the event that the
junction temperature gets too high, the LTC3427 will go
into thermal shutdown and all switching will stop until the
internal temperature drops at which point a soft-start cycle
will be initiated.
3427fa
8
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