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参数资料
| 型号： | LTC3459ES6#TR |
| 厂商： | Linear Technology |
| 文件页数： | 10/12页 |
| 文件大小： | 0K |
| 描述： | IC REG BOOST SYNC ADJ SOT23-6 |
| 标准包装： | 2,500 |
| 类型： | 升压（升压） |
| 输出类型： | 可调式 |
| 输出数： | 1 |
| 输出电压： | 2.5 V ~ 10 V |
| 输入电压： | 1.5 V ~ 5.5 V |
| PWM 型： | Burst Mode? |
| 同步整流器： | 是 |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | SOT-23-6 细型，TSOT-23-6 |
| 包装： | 带卷 (TR) |
| 供应商设备封装： | TSOT-23-6 |
LTC3459
TYPICAL APPLICATIONS
controlled, preventing any damaging effects of inrush
L1
current. Proper heat sinking of the package is required in
this application as the die may dissipate 100mW to 200mW
during initial charging. When V OUT is greater than ~3.5V,
normal boost mode operation and ef?ciency begin, with
the P-channel MOSFET acting as a synchronous switch.
Average input current is a constant 50mA during charg-
3.3V
+
1μF
OFF ON
SW
V IN V OUT
LTC3459
SHDN FB
GND
1M
332k
1μF
V OUT
5V
C OUT
2F
ing, where the current delivered to the SuperCap varies
somewhat with duty cycle. Once the SuperCap is charged
to 5V, the LTC3459 begins to regulate and the input cur-
rent is reduced to the amount required to support the load
and/or self discharge of the SuperCap.
3459 F05
C OUT : MAXWELL TECHNOLOGIES ULTRACAP PC5-5, 2F, 5V
L1: 33μH, 1.7Ω TAIYO YUDEN LB2016
Figure 5. Charging a SuperCap from a 3.3V Source
PACKAGE DESCRIPTION
DC Package
6-Lead Plastic DFN (2mm × 2mm)
(Reference LTC DWG # 05-08-1703)
R = 0.115
TYP
0.38
0.05
0.56
0.05
4
6
0.675 0.05
(2 SIDES)
2.50 0.05
1.15 0.05 0.61 0.05
(2 SIDES)
0.25
0.50 BSC
PACKAGE
OUTLINE
0.05
PIN 1 BAR
TOP MARK
(SEE NOTE 6)
0.200 REF
2.00 0.10
(4 SIDES)
0.75 0.05
3
PIN 1
CHAMFER OF
EXPOSED PAD
(DC6) DFN 1103
1
0.25
0.05
0.50 BSC
1.42 0.05
(2 SIDES)
1.37 0.05
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
0.00 – 0.05
BOTTOM VIEW—EXPOSED PAD
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WCCD-2)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
3459fc
10
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