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参数资料
| 型号： | LTC3459ES6#TR |
| 厂商： | Linear Technology |
| 文件页数： | 11/12页 |
| 文件大小： | 0K |
| 描述： | IC REG BOOST SYNC ADJ SOT23-6 |
| 标准包装： | 2,500 |
| 类型： | 升压（升压） |
| 输出类型： | 可调式 |
| 输出数： | 1 |
| 输出电压： | 2.5 V ~ 10 V |
| 输入电压： | 1.5 V ~ 5.5 V |
| PWM 型： | Burst Mode? |
| 同步整流器： | 是 |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | SOT-23-6 细型，TSOT-23-6 |
| 包装： | 带卷 (TR) |
| 供应商设备封装： | TSOT-23-6 |
LTC3459
PACKAGE DESCRIPTION
DCB Package
6-Lead Plastic DFN (2mm × 3mm)
(Reference LTC DWG # 05-08-1715)
3.55 ± 0.05
1.65 ± 0.05
(2 SIDES)
0.70 ± 0.05
PACKAGE
OUTLINE
2.00 ± 0.10
(2 SIDES)
3.00 ± 0.10
(2 SIDES)
R = 0.115
TYP
R = 0.05
TYP
1.65 ± 0.10
(2 SIDES)
4
6
0.40 ± 0.10
2.15 ± 0.05
PIN 1 BAR
TOP MARK
(SEE NOTE 6)
PIN 1 NOTCH
R0.20 OR 0.25
× 45 ° CHAMFER
1
0.25 ± 0.05
0.50 BSC
0.200 REF
0.75 ± 0.05
3
(DCB6) DFN 0405
0.25 ± 0.05
0.50 BSC
1.35 ± 0.05
(2 SIDES)
1.35 ± 0.10
(2 SIDES)
NOTE:
RECOMMENDED SOLDER PAD
PITCH AND DIMENSIONS
0.00 – 0.05
BOTTOM VIEW—EXPOSED PAD
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (TBD)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
S6 Package
6-Lead Plastic TSOT-23
(Reference LTC DWG # 05-08-1636)
0.62
MAX
0.95
REF
1.22 REF
2.90 BSC
(NOTE 4)
3.85 MAX 2.62 REF
1.4 MIN
2.80 BSC
1.50 – 1.75
(NOTE 4)
PIN ONE ID
RECOMMENDED SOLDER PAD LAYOUT
PER IPC CALCULATOR
0.20 BSC
DATUM ‘A’
0.30 – 0.50 REF
NOTE:
0.09 – 0.20
(NOTE 3)
0.95 BSC
0.80 – 0.90
1.00 MAX
1.90 BSC
0.30 – 0.45
6 PLCS (NOTE 3)
0.01 – 0.10
S6 TSOT-23 0302 REV B
1. DIMENSIONS ARE IN MILLIMETERS
2. DRAWING NOT TO SCALE
3. DIMENSIONS ARE INCLUSIVE OF PLATING
4. DIMENSIONS ARE EXCLUSIVE OF MOLD FLASH AND METAL BURR
5. MOLD FLASH SHALL NOT EXCEED 0.254mm
6. JEDEC PACKAGE REFERENCE IS MO-193
3459fc
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
11
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