参数资料
型号: LTC3526BEDC#TRPBF
厂商: Linear Technology
文件页数: 10/16页
文件大小: 0K
描述: IC REG BOOST SYNC ADJ 0.5A 6DFN
标准包装: 2,500
类型: 升压(升压)
输出类型: 可调式
输出数: 1
输出电压: 1.6 V ~ 5.25 V
输入电压: 0.5 V ~ 5 V
PWM 型: 电流模式,Burst Mode?
频率 - 开关: 1MHz
电流 - 输出: 500mA
同步整流器:
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 6-WFDFN 裸露焊盘
包装: 带卷 (TR)
供应商设备封装: 6-DFN-EP(2x2)
LTC3526/LTC3526B
APPLICATIONS INFORMATION
V IN > V OUT OPERATION
The LTC3526/LTC3526B will maintain voltage regulation
even when the input voltage is above the desired output
voltage. Note that the efficiency is much lower in this mode,
and the maximum output current capability will be less.
Refer to the Typical Performance Characteristics.
SHORT-CIRCUIT PROTECTION
The LTC3526/LTC3526B output disconnect feature allows
output short circuit while maintaining a maximum inter-
nally set current limit. To reduce power dissipation under
short-circuit conditions, the peak switch current limit is
reduced to 400mA (typical).
SCHOTTKY DIODE
Although it is not required, adding a Schottky diode from
SW to V OUT will improve efficiency by about 2%. Note
that this defeats the output disconnect and short-circuit
protection features.
PCB LAYOUT GUIDELINES
The high speed operation of the LTC3526/LTC3526B
demands careful attention to board layout. A careless
layout will result in reduced performance. Figure 2 shows
the recommended component placement. A large ground
pin copper area will help to lower the die temperature. A
multilayer board with a separate ground plane is ideal, but
not absolutely necessary.
LTC3526
SW 1
COMPONENT SELECTION
Inductor Selection
The LTC3526/LTC3526B can utilize small surface mount
chip inductors due to their fast 1MHz switching frequency.
Inductor values between 3.3μH and 6.8μH are suitable for
most applications. Larger values of inductance will allow
slightly greater output current capability (and lower the
Burst Mode threshold) by reducing the inductor ripple cur-
rent. Increasing the inductance above 10μH will increase
size while providing little improvement in output current
capability.
The minimum inductance value is given by:
L > V IN(MIN) ? ( V OUT(MAX ) – V IN(MIN) )
Ripple ? V OUT ( M AX)
where:
Ripple = Allowable inductor current ripple (amps peak-
peak)
V IN(MIN) = Minimum input voltage
V OUT(MAX) = Maximum output voltage
The inductor current ripple is typically set for 20% to
40% of the maximum inductor current. High frequency
ferrite core inductor materials reduce frequency depen-
dent power losses compared to cheaper powdered iron
types, improving efficiency. The inductor should have
low ESR (series resistance of the windings) to reduce the
I 2 R power losses, and must be able to support the peak
6 V OUT
GND 2
5 FB
MINIMIZE
TRACE ON FB
AND SW
V IN
+
V IN 3
4 SHDN
MULTIPLE VIAS
TO GROUND PLANE
3526 F02
Figure 2. Recommended Component Placement for Single Layer Board
3526bfd
 0
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