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| 型号： | LTC3611IWP#TRPBF |
| 厂商： | Linear Technology |
| 文件页数： | 19/26页 |
| 文件大小： | 0K |
| 描述： | IC REG BUCK SYNC ADJ 10A 64QFN |
| 标准包装： | 2,000 |
| 类型： | 降压（降压） |
| 输出类型： | 可调式 |
| 输出数： | 1 |
| 输出电压： | 0.6 V ~ 32 V |
| 输入电压： | 4.5 V ~ 32 V |
| PWM 型： | 电流模式 |
| 频率 - 开关： | 1MHz |
| 电流 - 输出： | 10A |
| 同步整流器： | 是 |
| 工作温度： | -40°C ~ 125°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 64-VFQFN 裸露焊盘 |
| 包装： | 带卷 (TR) |
| 供应商设备封装： | 64-QFN（9x9） |
LTC3611
APPLICATIONS INFORMATION
How to Reduce SW Ringing
As with any switching regulator, there will be voltage ring-
ing on the SW node, especially for high input voltages.
The ringing amplitude and duration is dependent on the
switching speed (gate drive), layout (parasitic inductance)
and MOSFET output capacitance. This ringing contributes
to the overall EMI, noise and high frequency ripple. One
way to reduce ringing is to optimize layout. A good layout
minimizes parasitic inductance. Adding RC snubbers from
SW to GND is also an effective way to reduce ringing.
Finally, adding a resistor in series with the BOOST pin
will slow down the MOSFET turn-on slew rate to dampen
ringing, but at the cost of reduced ef ?ciency. Note that
since the IC is buffered from the high frequency transients
by PCB and bondwire inductances, the ringing by itself is
normally not a concern for controller reliability.
PC Board Layout Checklist
When laying out a PC board follow one of the two sug-
gested approaches. The simple PC board layout requires
a dedicated ground plane layer. Also, for higher currents,
a multilayer board is recommended to help with heat
sinking of power components.
? The ground plane layer should not have any traces and
it should be as close as possible to the layer with the
LTC3611.
? Place C IN and C OUT all in one compact area, close to
the LTC3611. It may help to have some components
on the bottom side of the board.
? Use a compact plane for the switch node (SW) to improve
cooling of the MOSFETs and to keep EMI down.
? Use planes for V IN and V OUT to maintain good voltage
?ltering and to keep power losses low.
? Flood all unused areas on all layers with copper. Flood-
ing with copper reduces the temperature rise of power
components. Connect these copper areas to any DC
net (V IN , V OUT , GND or to any other DC rail in your
system).
When laying out a printed circuit board without a ground
plane, use the following checklist to ensure proper opera-
tion of the controller. These items are also illustrated in
Figure 7.
? Segregate the signal and power grounds. All small-
signal components should return to the SGND pin at
one point, which is then tied to the PGND pin.
? Connect the input capacitor(s), C IN , close to the IC. This
capacitor carries the MOSFET AC current.
? Keep the high dV/dT SW, BOOST and TG nodes away
from sensitive small-signal nodes.
? Connect the INTV CC decoupling capacitor, C VCC , closely
to the INTV CC and PGND pins.
? Connect the top driver boost capacitor, C B , closely to
the BOOST and SW pins.
? Connect the V IN pin decoupling capacitor, C F , closely
to the V IN and PGND pins.
? Keep small-signal components close to the LTC3611.
? Ground connections (including LTC3611 SGND and
PGND) should be made through immediate vias to
the ground plane. Use several larger vias for power
components.
3611fd
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相关代理商/技术参数 |
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| LTC3612EFE#PBF | 功能描述:IC REG BUCK SYNC ADJ 3A 20TSSOP RoHS:是 类别:集成电路 (IC) >> PMIC - 稳压器 - DC DC 开关稳压器 系列:- 设计资源:Design Support Tool 标准包装:1 系列:- 类型:升压（升压） 输出类型:固定 输出数:1 输出电压:3V 输入电压:0.75 V ~ 2 V PWM 型:- 频率 - 开关:- 电流 - 输出:100mA 同步整流器:是 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:SOT-23-5 细型，TSOT-23-5 包装:剪切带 (CT) 供应商设备封装:TSOT-23-5 其它名称:AS1323-BTTT-30CT |
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| LTC3612EUDC#PBF | 功能描述:IC REG BUCK SYNC ADJ 3A 20QFN RoHS:是 类别:集成电路 (IC) >> PMIC - 稳压器 - DC DC 开关稳压器 系列:- 标准包装:250 系列:- 类型:降压（降压） 输出类型:固定 输出数:1 输出电压:1.2V 输入电压:2.05 V ~ 6 V PWM 型:电压模式 频率 - 开关:2MHz 电流 - 输出:500mA 同步整流器:是 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:6-UFDFN 包装:带卷 (TR) 供应商设备封装:6-SON（1.45x1） 产品目录页面:1032 (CN2011-ZH PDF) 其它名称:296-25628-2 |
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| LTC3612EUDCPBF | 制造商:Linear Technology 功能描述:DC-DC Converter Step-Down 5.5V QFN20EP |
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