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| 型号： | LTC3614EUDD#TRPBF |
| 厂商： | LINEAR TECHNOLOGY CORP |
| 元件分类： | 稳压器 |
| 英文描述： | 10.5 A SWITCHING REGULATOR, 2700 kHz SWITCHING FREQ-MAX, PQCC24 |
| 封装： | 3 X 5 MM, LEAD FREE, PLASTIC, QFN-24 |
| 文件页数： | 25/30页 |
| 文件大小： | 438K |
| 代理商： | LTC3614EUDD#TRPBF |
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LTC3614
4
3614fa
Note 1: Stresses beyond those listed under Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to any Absolute
Maximum Rating condition for extended periods may affect device
reliability and lifetime.
Note 2: The LTC3614 is tested under pulsed load conditions such that
TJ ≈ TA. The LTC3614E is guaranteed to meet specications from
0°C to 85°C junction temperature. Specications over the –40°C to
125°C operating junction temperature range are assured by design,
characterization and correlation with statistical process controls. The
LTC3614I is guaranteed to meet specications over the full –40°C to 125°C
operating junction temperature. The junction temperature (TJ) is calculated
from the ambient temperature (TA) and power dissipation (PD) according
to the formula: TJ = TA + (PD θJA°C/W), where θJA is the package thermal
impedance. The maximum ambient temperature is determined by specic
operating conditions in conjunction with board layout, the rated package
thermal resistance and other environmental factors.
Note 3: This parameter is tested in a feedback loop which servos VFB to
the midpoint for the error amplier (VITH = 0.75V).
ELECTRICAL CHARACTERISTICS The l denotes the specications which apply over the full operating junction
temperature range, otherwise specications are at TA = 25°C. VIN = 3.3V, RT/SYNC = SVIN unless otherwise specied (Notes 1, 2, 11).
SYMBOL
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
PGOOD
Power Good Voltage Windows
TRACK/SS = SVIN, Entering Window
VFB Ramping Up
VFB Ramping Down
–3
3
–6
6
%
TRACK/SS = SVIN, Leaving Window
VFB Ramping Up
VFB Ramping Down
9
–9
11
–11
%
tPGOOD
Power Good Blanking Time
Entering and Leaving Window
70
105
140
μs
RPGOOD
Power Good Pull-Down On-Resistance
8
17
33
Ω
VRUN
RUN voltage
Input High
Input Low
l
1
0.4
V
Note 4: External compensation on ITH pin.
Note 5: Tying the ITH pin to SVIN enables the internal compensation and
AVP mode.
Note 6: Dynamic supply current is higher due to the internal gate charge
being delivered at the switching frequency.
Note 7: See description of the TRACK/SS pin in the Pin Functions section.
Note 8: In sourcing mode the average output current is owing out of the
SW pin. In sinking mode the average output current is owing into the SW
Pin.
Note 9: See description of the MODE pin in the Pin Functions section.
Note 10: Guaranteed by correlation and design to wafer level
measurements for QFN packages.
Note 11: This IC includes overtemperature protection that is intended
to protect the device during momentary overload conditions. Junction
temperature will exceed 125°C when overtemperature protection is active.
Continuous operation above the specied maximum operating junction
temperature may impair device reliability.
TYPICAL PERFORMANCE CHARACTERISTICS V
IN = 3.3V, RT/SYNC = SVIN unless otherwise noted.
Efciency vs Load Current
Burst Mode Operation (VMODE = 0V)
Efciency vs Load Current
Burst Mode Operation (VMODE = 0V)
Efciency vs Load Current
OUTPUT CURRENT (mA)
30
EFFICIENCY
(%)
90
100
20
10
80
50
70
60
40
1
100
1000
10000
3614 G01
0
10
VIN = 2.5V
VIN = 3.3V
VIN = 5V
VOUT = 1.8V
OUTPUT CURRENT (mA)
30
EFFICIENCY
(%)
90
100
20
10
80
50
70
60
40
1
100
1000
10000
3614 G02
0
10
VIN = 2.5V
VIN = 3.3V
VIN = 5V
VOUT = 1.2V
OUTPUT CURRENT (mA)
30
EFFICIENCY
(%)
90
100
20
10
80
50
70
60
40
1
100
1000
10000
3614 G03
0
10
Burst Mode OPERATION
PULSE-SKIPPING
FORCED CONTINUOUS
VOUT = 1.8V
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