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参数资料
| 型号： | LTC3862HGN#PBF |
| 厂商： | LINEAR TECHNOLOGY CORP |
| 元件分类： | 稳压器 |
| 英文描述： | DUAL SWITCHING CONTROLLER, 500 kHz SWITCHING FREQ-MAX, PDSO24 |
| 封装： | 0.150 INCH, LEAD FREE, PLASTIC, SSOP-24 |
| 文件页数： | 28/40页 |
| 文件大小： | 613K |
| 代理商： | LTC3862HGN#PBF |
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LTC3862
34
3862fb
For the bulk capacitance, which we assume contributes
1% to the total output ripple, the minimum required
capacitance is approximately:
C
I
nV
f
A
Vk
OUT
OMAX
OUT
≥=
()
.
.
001
5
0 01 2 48
300 H
Hz
T
μF
= 17 5
.
For this application, in order to obtain both low ESR
and an adequate ripple current rating (see Figure 23),
two 100μF, 63V aluminum electrolytic capacitors were
connected in parallel with four 6.8μF, 50V ceramic
capacitors. Figure 26 illustrates the switching wave-
forms for this application circuit.
2. In order to help dissipate the power from the MOSFETs
and diodes, keep the ground plane on the layers closest
to the power components. Use power planes for the
MOSFETs and diodes in order to maximize the heat
spreading from these components into the PCB.
3. Place all power components in a tight area. This will
minimize the size of high current loops. The high di/dt
loops formed by the sense resistor, power MOSFET,
the boost diode and the output capacitor should be
kept as small as possible to avoid EMI.
4. Orient the input and output capacitors and current
sense resistors in a way that minimizes the distance
between the pads connected to the ground plane.
Keep the capacitors for INTVCC, 3V8 and VIN as close
as possible to LTC3862.
5. Place the INTVCC decoupling capacitor as close as
possible to the INTVCC and PGND pins, on the same
layer as the IC. A low ESR (X5R or better) 4.7μF to
10μF ceramic capacitor should be used.
6. Use a local via to ground plane for all pads that
connect to the ground. Use multiple vias for power
components.
7. Place the small-signal components away from high
frequency switching nodes on the board. The pinout
of the LTC3862 was carefully designed in order to
make component placement easy. All of the power
components can be placed on one side of the IC, away
from all of the small-signal components.
8. The exposed area on the bottom of the QFN package
is internally connected to PGND; however it should
not be used as the main path for high current ow.
9. The MOSFETs should also be placed on the same
layer of the board as the sense resistors. The MOSFET
source should connect to the sense resistor using a
short, wide PCB trace.
APPLICATIONS INFORMATION
SW1
50V/DIV
SW2
50V/DIV
2.5μs/DIV
VIN = 24V
VOUT = 48V, 1.5A
3862 F26
VOUT
100mV/DIV
AC COUPLED
IL1
5A/DIV
IL2
5A/DIV
Figure 26. LTC3862 Switching Waveforms for Boost Converter
PC Board Layout Checklist
When laying out the printed circuit board, the following
checklist should be used to ensure proper operation of
the converter:
1. For lower power applications a 2-layer PC board is suf-
cient. However, for higher power levels, a multilayer
PC board is recommended. Using a solid ground plane
and proper component placement under the circuit is
the easiest way to ensure that switching noise does
not affect the operation.
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