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参数资料
| 型号： | LTC4302IMS-2#TRPBF |
| 厂商： | Linear Technology |
| 文件页数： | 19/20页 |
| 文件大小： | 298K |
| 描述： | IC BUFFER 2-WIRE BUS 10-MSOP |
| 标准包装： | 2,500 |
| 类型： | 热交换开关 |
| 应用： | 通用型缓冲器/总线扩展器 |
| 内部开关： | 是 |
| 电源电压： | 2.7 V ~ 5.5 V |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 10-TFSOP，10-MSOP（0.118"，3.00mm 宽） |
| 供应商设备封装： | 10-MSOP |
| 包装： | 带卷 (TR) |
LTC4302-1/LTC4302-2
19
sn430212 430212fs
PACKAGE DESCRIPTIO
MSOP (MS) 0603
0.53 ?0.152
(.021 ?.006)
SEATING
PLANE
0.18
(.007)
1.10
(.043)
MAX
0.17 0.27
(.007 .011)
TYP
0.127 ?0.076
(.005 ?.003)
0.86
(.034)
REF
0.50
(.0197)
BSC
1 2 3 4 5
4.90 ?0.152
(.193 ?.006)
0.497 ?0.076
(.0196 ?.003)
REF
8
9
10
7 6
3.00 ?0.102
(.118 ?.004)
(NOTE 3)
3.00 ?0.102
(.118 ?.004)
(NOTE 4)
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
0.254
(.010)
0? 6?TYP
DETAIL A
DETAIL A
GAUGE PLANE
5.23
(.206)
MIN
3.20 3.45
(.126 .136)
0.889 ?0.127
(.035 ?.005)
RECOMMENDED SOLDER PAD LAYOUT
0.305 ?0.038
(.0120 ?.0015)
TYP
0.50
(.0197)
BSC
Repeater/Bus Extender Application
Users who wish to connect two 2-wire systems separated
by a distance can do so by connecting two LTC4302-1s
back-to-back as shown in Figure 16. The I
2
C specification
allows for 400pF maximum bus capacitance, severely
limiting the length of the bus. The SMBus specification
places no restriction on bus capacitance; however, the
limited impedances of devices connected to the bus re-
quire systems to remain small, if rise and fall time speci-
fications are to be met. The strong pull-up and pull-down
impedances of the LTC4302-1 are capable of meeting rise
and fall time specifications for up to 1nF of capacitance,
thus allowing much more interconnect distance. In this
situation, the differential ground voltage between the two
systems may limit the allowed distance because a valid
logic low voltage with respect to the ground at one end of
the system may violate the allowed V
OL
specification with
respect to the ground at the other end. In addition, the
connection circuitry offset voltages of the back-to-back
LTC4302-1s add together, directly contributing to the
same problem.
APPLICATIO S I FOR ATIO
U
U
U
MS Package
10-Lead Plastic MSOP
(Reference LTC DWG # 05-08-1661)
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
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