参数资料
型号: LTC4304CDD#TRPBF
厂商: Linear Technology
文件页数: 15/16页
文件大小: 644K
描述: IC BUS BUFFER I2C 10-DFN
产品培训模块: LTC4310 - Hot-Swappable I²C Isolators
标准包装: 2,500
类型: 热交换开关
应用: 通用型缓冲器/总线扩展器
内部开关:
电源电压: 2.7 V ~ 5.5 V
工作温度: 0°C ~ 70°C
安装类型: 表面贴装
封装/外壳: 10-WFDFN 裸露焊盘
供应商设备封装: 10-DFN(3x3)
包装: 带卷 (TR)
LTC4304
15
4304fa
PACKAGE DESCRIPTIO
MSOP (MS) 0603
0.53 0.152
(.021 .006)
SEATING
PLANE
0.18
(.007)
1.10
(.043)
MAX
0.17  0.27
(.007  .011)
TYP
0.127 0.076
(.005 .003)
0.86
(.034)
REF
0.50
(.0197)
BSC
1  2  3  4  5
4.90 0.152
(.193 .006)
0.497 0.076
(.0196 .003)
REF
8
9
10
7 6
3.00 0.102
(.118 .004)
(NOTE 3)
3.00 0.102
(.118 .004)
(NOTE 4)
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
  MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
  INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
0.254
(.010)
0  6 TYP
DETAIL A
DETAIL A
GAUGE PLANE
5.23
(.206)
MIN
3.20  3.45
(.126  .136)
0.889 0.127
(.035 .005)
RECOMMENDED SOLDER PAD LAYOUT
0.305 0.038
(.0120 .0015)
TYP
0.50
(.0197)
BSC
MS Package
10-Lead Plastic MSOP
(Reference LTC DWG # 05-08-1661)
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
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