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参数资料
| 型号： | LTC4304CDD#TRPBF |
| 厂商： | Linear Technology |
| 文件页数： | 8/16页 |
| 文件大小： | 644K |
| 描述： | IC BUS BUFFER I2C 10-DFN |
| 产品培训模块： | LTC4310 - Hot-Swappable I²C Isolators |
| 标准包装： | 2,500 |
| 类型： | 热交换开关 |
| 应用： | 通用型缓冲器/总线扩展器 |
| 内部开关： | 是 |
| 电源电压： | 2.7 V ~ 5.5 V |
| 工作温度： | 0°C ~ 70°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 10-WFDFN 裸露焊盘 |
| 供应商设备封装： | 10-DFN（3x3） |
| 包装： | 带卷 (TR) |
LTC4304
8
4304fa
same, a difference in rise-time occurs which is directly
proportional to the difference in capacitance between the
two sides. This effect is displayed in Figure 1 for a V
CC
= 3.3V and a 10k pull-up resistor on each side (50pF on
one side and 150pF on the other). Since the output side
has less capacitance than the input, it rises faster and the
effective t
PLH
is negative.
There is a propagation delay, t
PHL
, through the connec-
tion circuitry for falling waveforms. Figure 2 shows the
falling edge waveforms. An external driver pulls down
the voltage on the side with 50pF capacitance; LTC4304
pulls down the voltage on the opposite side with a delay
of 80ns. This delay is always positive and is a function of
supply voltage, temperature and the pull-up resistors and
equivalent bus capacitances on both sides of the bus. The
Typical Performance Characteristics section shows t
PHL
as a function of temperature and voltage for 10k pull-up
resistors and 100pF equivalent capacitance on both sides
of the part. Larger output capacitances translate to longer
delays. Users must quantify the difference in propagation
times for a rising edge versus a falling edge in their systems
and adjust setup and hold times accordingly.
READY Digital Output
The READY pin provides a digital ag which indicates the
status of the connection circuitry described previously in
the Connection Circuitry section. READY is high when
the connection circuitry is active, and pulls low when
there is not a valid connection. The pin is driven by an
open drain pull-down capable of sinking 3mA while hold-
ing 0.4V on the pin. Connect a resistor of 10k to V
CC
to
provide the pull-up.
FAULT
Digital Output
The FAULT pin provides a digital ag which is low when
SDAOUT and SCLOUT have not both been high within 30ms
(typical). The pin is driven by an open drain pull-down
capable of sinking 3mA while holding 0.4V on the pin.
Connect a resistor of 10k to V
CC
to provide the pull-up.
ENABLE
When the ENABLE pin is driven below 0.8V with respect
to the LTC4304s ground, the backplane side is discon-
nected from the card side, and the READY pin is internally
pulled low. When the pin is driven above 2V, the part
waits for data transactions on both the backplane and
card sides to be complete (as described in the Start-Up
section) before connecting the two sides. At this time the
internal pulldown on READY releases. When ENABLE is
low, automatic clocking is disabled.
Figure 1. Input-Output Connection t
PLH
Figure 2. Input-Output Connection t
PHL
OUTPUT SIDE
50pF
0.5V/DIV
INPUT SIDE
150pF
0.5V/DIV
200ns/DIV
4303 F01
INPUT SIDE
50pF
0.5V/DIV
OUTPUT SIDE
150pF
0.5V/DIV
20ns/DIV
4303 F02
OPERATION
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相关代理商/技术参数 |
参数描述 |
|---|---|
| LTC4304CMS | 制造商:Linear Technology 功能描述:MS-Bus Buffers, I2C Bus Buffer with Stuck Bus Recovery |
| LTC4304CMS#PBF | 功能描述:IC BUS BUFFER I2C 10-MSOP RoHS:是 类别:集成电路 (IC) >> PMIC - 热交换 系列:- 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:119 系列:- 类型:热交换控制器 应用:通用型，PCI Express? 内部开关:无 电流限制:- 电源电压:3.3V，12V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:80-TQFP 供应商设备封装:80-TQFP（12x12） 包装:托盘 产品目录页面:1423 (CN2011-ZH PDF) |
| LTC4304CMS#TRPBF | 功能描述:IC BUS BUFFER I2C 10-MSOP RoHS:是 类别:集成电路 (IC) >> PMIC - 热交换 系列:- 标准包装:50 系列:- 类型:热交换控制器 应用:-48V 远程电力系统，AdvancedTCA ? 系统，高可用性 内部开关:无 电流限制:可调 电源电压:11.5 V ~ 14.5 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:10-TFSOP，10-MSOP（0.118"，3.00mm 宽） 供应商设备封装:10-MSOP 包装:管件 |
| LTC4304IDD | 制造商:Linear Technology 功能描述:Hot Swappable Bus Buffer 10-Pin DFN EP |
| LTC4304IDD#PBF | 功能描述:IC BUS BUFFER I2C 10-DFN RoHS:是 类别:集成电路 (IC) >> PMIC - 热交换 系列:- 产品培训模块:Obsolescence Mitigation Program 标准包装:100 系列:- 类型:热插拔开关 应用:通用 内部开关:是 电流限制:可调 电源电压:9 V ~ 13.2 V 工作温度:-40°C ~ 150°C 安装类型:表面贴装 封装/外壳:10-WFDFN 裸露焊盘 供应商设备封装:10-TDFN-EP（3x3） 包装:管件 |
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