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参数资料
| 型号： | LTC4307CDD#PBF |
| 厂商： | Linear Technology |
| 文件页数： | 1/16页 |
| 文件大小： | 176K |
| 描述： | IC BUFFER 2-WIRE BUS 8-DFN |
| 产品培训模块： | LTC4310 - Hot-Swappable I²C Isolators |
| 标准包装： | 121 |
| 类型： | 热交换开关 |
| 应用： | 通用型缓冲器/总线扩展器 |
| 内部开关： | 是 |
| 电源电压： | 2.3 V ~ 5.5 V |
| 工作温度： | 0°C ~ 70°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 8-WFDFN 裸露焊盘 |
| 供应商设备封装： | 8-DFN-EP（3x3） |
| 包装： | 管件 |
LTC4307
1
4307f
Low Offset Hot Swappable
2-Wire Bus Buffer with Stuck
Bus Recovery
The LTC
?/DIV>
4307 hot swappable, 2-wire bus buffer allows
I/O card insertion into a live backplane without corrup-
tion of the data and clock busses. The LTC4307 provides
bidirectional buffering, keeping the backplane and card
capacitances isolated. Low offset and high V
OL
tolerance
allows multiple devices to be cascaded on the clock and
data busses. If SDAOUT or SCLOUT are low for 30ms, the
LTC4307 will automatically break the bus connection. At
this time the LTC4307 automatically generates up to 16
clock pulses on SCLOUT in an attempt to free the bus. A
connection will resume if the stuck bus is cleared.
During insertion, the SDA and SCL lines are pre-charged
to 1V to minimize bus disturbances. When driven high,
the ENABLE input allows the LTC4307 to connect after a
stop bit or bus idle. Driving ENABLE low breaks the con-
nection between SDAIN and SDAOUT, SCLIN and SCLOUT.
READY is an open-drain output which indicates that the
backplane and card sides are connected.
?/DIV>
Live Board Insertion
?/DIV>
Servers
?/DIV>
Capacitance Buffer/Bus Extender
?/DIV>
RAID Systems
?/DIV>
ATCA
?/DIV>
Bidirectional Buffer with Stuck Bus Recovery
?/DIV>
60mV Buffer Offset Independent of Load
?/DIV>
30ms Stuck Bus Timeout
?/DIV>
Compatible with Non-Compliant V
OL
I
2
C Devices
?/DIV>
Prevents SDA and SCL Corruption During Live
Board Insertion and Removal from Backplane
?/DIV>
?/SPAN>5kV Human Body Model ESD Protection
?/DIV>
Isolates Input SDA and SCL Line from Output
?/DIV>
Compatible with I
2
C
TM
, I
2
C Fast Mode and SMBus
?/DIV>
READY Open-Drain Output
?/DIV>
1V Precharge on All SDA and SCL Lines
?/DIV>
High Impedance SDA, SCL Pins for V
CC
= 0V
?/DIV>
Small 8-Lead (3mm ?3mm) DFN and 8-Lead MSOP
Packages
APPLICATIO S
FEATURES
DESCRIPTIO
TYPICAL APPLICATIO
V
CC
3.3V
ENABLE
10k
LTC4307
SCLIN
SDAIN
SCLOUT
SDAOUT
READY
GND
BACKPLANE
CONNECTOR
10k
2.7k
10k
10k
0.01糉
CARD_SCL
CARD_SDA
10k
100k
3.3V
V
CC
ENABLE
LTC4307
SCLIN
SDAIN
SCLOUT
SDAOUT
READY
GND
CARD
10k
4307 TA01a
3.3V
2.7k
MICRO-
CONTROLLER
CARD
CONNECTOR
0.01糉
100ns/DIV
0
0
100
200
300
400
600
500
200
400
600
800
1000
4307 TA01b
SDAOUT
SDAIN
LOW
OFFSET
Rising Edge from Asserted Low
, LT, LTC and LTM are registered trademarks of Linear Technology Corporation.
All other trademarks are the property of their respective owners.
Protected by U.S. Patents, including 7032051, 6356140, 6650174
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相关代理商/技术参数 |
参数描述 |
|---|---|
| LTC4307CMS8#PBF | 功能描述:IC BUFFER 2-WIRE BUS 8-MSOP RoHS:是 类别:集成电路 (IC) >> PMIC - 热交换 系列:- 标准包装:50 系列:- 类型:热交换控制器 应用:-48V 远程电力系统，AdvancedTCA ? 系统，高可用性 内部开关:无 电流限制:可调 电源电压:11.5 V ~ 14.5 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:10-TFSOP，10-MSOP（0.118"，3.00mm 宽） 供应商设备封装:10-MSOP 包装:管件 |
| LTC4307CMS8#PBF | 制造商:Linear Technology 功能描述:IC, HOT SWAP BUS BUFFER, MSOP-8 |
| LTC4307CMS8#TRPBF | 功能描述:IC BUFFER 2-WIRE BUS 8-MSOP RoHS:是 类别:集成电路 (IC) >> PMIC - 热交换 系列:- 标准包装:50 系列:- 类型:热交换控制器 应用:-48V 远程电力系统，AdvancedTCA ? 系统，高可用性 内部开关:无 电流限制:可调 电源电压:11.5 V ~ 14.5 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:10-TFSOP，10-MSOP（0.118"，3.00mm 宽） 供应商设备封装:10-MSOP 包装:管件 |
| LTC4307CMS8-1#PBF | 功能描述:IC BUFFER 2-WIRE BUS 8-MSOP RoHS:是 类别:集成电路 (IC) >> PMIC - 热交换 系列:- 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:119 系列:- 类型:热交换控制器 应用:通用型，PCI Express? 内部开关:无 电流限制:- 电源电压:3.3V，12V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:80-TQFP 供应商设备封装:80-TQFP（12x12） 包装:托盘 产品目录页面:1423 (CN2011-ZH PDF) |
| LTC4307CMS8-1#TRPBF | 功能描述:IC BUFFER 2-WIRE BUS 8-MSOP RoHS:是 类别:集成电路 (IC) >> PMIC - 热交换 系列:- 标准包装:50 系列:- 类型:热交换控制器 应用:-48V 远程电力系统，AdvancedTCA ? 系统，高可用性 内部开关:无 电流限制:可调 电源电压:11.5 V ~ 14.5 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:10-TFSOP，10-MSOP（0.118"，3.00mm 宽） 供应商设备封装:10-MSOP 包装:管件 |
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