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参数资料
| 型号： | LTC4315IMS#PBF |
| 厂商： | Linear Technology |
| 文件页数： | 11/20页 |
| 文件大小： | 0K |
| 描述： | IC 2WIRE BUS BUFFER 12MSOP |
| 标准包装： | 37 |
| 类型： | 2线总线缓冲器 |
| Tx/Rx类型： | I²C Logic |
| 电容 - 输入： | 10pF |
| 电源电压： | 2.9 V ~ 5.5 V |
| 电流 - 电源： | 8.1mA |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 12-TSSOP（0.118"，3.00mm 宽） |
| 供应商设备封装： | 12-MSOP |
| 包装： | 管件 |
LTC4315
19
4315f
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However,noresponsibilityisassumedforitsuse.LinearTechnologyCorporationmakesnorepresenta-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
PACKAGE DESCRIPTION
DE/UE Package
12-Lead Plastic DFN (4mm
× 3mm)
(Reference LTC DWG # 05-08-1695 Rev D)
MS Package
12-Lead Plastic MSOP
(Reference LTC DWG # 05-08-1668 Rev )
4.00
±0.10
(2 SIDES)
3.00
±0.10
(2 SIDES)
NOTE:
1. DRAWING PROPOSED TO BE A VARIATION OF VERSION
(WGED) IN JEDEC PACKAGE OUTLINE M0-229
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
0.40
± 0.10
BOTTOM VIEW—EXPOSED PAD
1.70
± 0.10
0.75
±0.05
R = 0.115
TYP
R = 0.05
TYP
2.50 REF
1
6
12
7
PIN 1 NOTCH
R = 0.20 OR
0.35
× 45°
CHAMFER
PIN 1
TOP MARK
(NOTE 6)
0.200 REF
0.00 – 0.05
(UE12/DE12) DFN 0806 REV D
2.50 REF
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
2.20
±0.05
0.70
±0.05
3.60
±0.05
PACKAGE
OUTLINE
3.30
±0.10
0.25
± 0.05
0.50 BSC
1.70
± 0.05
3.30
±0.05
0.50 BSC
0.25
± 0.05
MSOP (MS12) 1107 REV
0.53
± 0.152
(.021
± .006)
SEATING
PLANE
0.18
(.007)
1.10
(.043)
MAX
0.22 – 0.38
(.009 – .015)
TYP
0.86
(.034)
REF
0.650
(.0256)
BSC
12 11 10 9 8 7
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
0.254
(.010)
0
° – 6° TYP
DETAIL “A”
GAUGE PLANE
5.23
(.206)
MIN
3.20 – 3.45
(.126 – .136)
0.889
± 0.127
(.035
± .005)
RECOMMENDED SOLDER PAD LAYOUT
0.42
± 0.038
(.0165
± .0015)
TYP
0.65
(.0256)
BSC
4.039
± 0.102
(.159
± .004)
(NOTE 3)
0.1016
± 0.0508
(.004
± .002)
12 3 4 5 6
3.00
± 0.102
(.118
± .004)
(NOTE 4)
0.406
± 0.076
(.016
± .003)
REF
4.90
± 0.152
(.193
± .006)
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
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