参数资料
型号: LTC6405IMS8E#TRPBF
厂商: LINEAR TECHNOLOGY CORP
元件分类: 模拟信号调理
英文描述: SPECIALTY ANALOG CIRCUIT, PDSO8
封装: LEAD FREE, MSOP-8
文件页数: 16/24页
文件大小: 281K
代理商: LTC6405IMS8E#TRPBF
LTC6405
23
6405fa
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
UD Package
16-Lead Plastic QFN (3mm
× 3mm)
(Reference LTC DWG # 05-08-1691)
PACKAGE DESCRIPTION
3.00
± 0.10
(4 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
1.45
± 0.05
(4 SIDES)
NOTE:
1. DRAWING CONFORMS TO JEDEC PACKAGE OUTLINE MO-220 VARIATION (WEED-2)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
PIN 1
TOP MARK
(NOTE 6)
0.40
± 0.10
BOTTOM VIEW—EXPOSED PAD
1.45
± 0.10
(4-SIDES)
0.75
± 0.05
R = 0.115
TYP
0.25
± 0.05
1
PIN 1 NOTCH R = 0.20 TYP
OR 0.25
× 45° CHAMFER
15
16
2
0.50 BSC
0.200 REF
2.10
± 0.05
3.50
± 0.05
0.70
±0.05
0.00 – 0.05
(UD16) QFN 0904
0.25
±0.05
0.50 BSC
PACKAGE OUTLINE
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