参数资料
型号: LTC692IS8#PBF
厂商: Linear Technology
文件页数: 17/20页
文件大小: 0K
描述: IC MPU SUPERVISORY CIRCUIT 8SOIC
标准包装: 100
类型: 简单复位/加电复位
监视电压数目: 1
输出: 开路漏极或开路集电极
复位: 高有效/低有效
复位超时: 最小为 140 ms
电压 - 阀值: 4.4V
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 8-SOIC(0.154",3.90mm 宽)
供应商设备封装: 8-SOIC
包装: 管件
LTC692/LTC693
PACKAGE DESCRIPTION
N8 Package
8-Lead PDIP (Narrow .300 Inch)
(Reference LTC DWG # 05-08-1510)
.400*
(10.160)
.300 – .325
.045 – .065
.130 ± .005
MAX
(7.620 – 8.255)
(1.143 – 1.651)
(3.302 ± 0.127)
8
7
6
5
.008 – .015
(0.203 – 0.381)
.065
(1.651)
TYP
.120
(3.048)
.020
.255 ± .015*
(6.477 ± 0.381)
–0.381
(
+.035
.325 –.015
+0.889
8.255
)
.100
(2.54)
BSC
MIN
.018 ± .003
(0.457 ± 0.076)
(0.508)
MIN
1
2
3
4
N8 1002
NOTE:
1. DIMENSIONS ARE
INCHES
MILLIMETERS
*THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.
MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .010 INCH (0.254mm)
S8 Package
8-Lead Plastic Small Outline (Narrow .150 Inch)
(Reference LTC DWG # 05-08-1610)
.189 – .197
.050 BSC
.045 ±.005
(4.801 – 5.004)
NOTE 3
8
7
6
5
.245
MIN
.160 ±.005
.228 – .244
(5.791 – 6.197)
.150 – .157
(3.810 – 3.988)
NOTE 3
.030 ±.005
TYP
RECOMMENDED SOLDER PAD LAYOUT
1
2
3
4
.010 – .020
(0.254 – 0.508)
.008 – .010
(0.203 – 0.254)
45°
0°– 8° TYP
.053 – .069
(1.346 – 1.752)
.004 – .010
(0.101 – 0.254)
NOTE:
1. DIMENSIONS IN
.016 – .050
(0.406 – 1.270)
INCHES
(MILLIMETERS)
.014 – .019
(0.355 – 0.483)
TYP
.050
(1.270)
BSC
2. DRAWING NOT TO SCALE
3. THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.
MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .006" (0.15mm)
SO8 0303
0692fb
17
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