参数资料
型号: LTM4600HVIV#PBF
厂商: Linear Technology
文件页数: 16/24页
文件大小: 0K
描述: IC DC/DC UMODULE 10A 104-LGA
产品培训模块: Power Module vs. Discrete DC to DC
软件下载: LTM4600HV Spice Model
产品目录绘图: LTM Series_15x15x2.8
设计资源: DC823B-B Design Files
LTM4600HVIV#PBF Footprint.bxl
特色产品: μModule Products
标准包装: 119
系列: µModule®
类型: 非隔离(POL)
输出数: 1
电压 - 输入(最小): 4.5V
电压 - 输入(最大): 28V
Voltage - Output 1: 0.6 ~ 5 V
电流 - 输出(最大): 10A
安装类型: 表面贴装
封装/外壳: 104-LGA
尺寸/尺寸: 0.59" L x 0.59" W x 0.11" H(15.0mm x 15.0mm x 2.8mm)
包装: 托盘
工作温度: -40°C ~ 85°C
效率: 92%
产品目录页面: 2711 (CN2011-ZH PDF)
配用: DC823B-B-ND - BOARD EVAL LTM4600HV
LTM4600HV
APPLICATIO S I FOR ATIO
10
9
V IN = 12V
V OUT = 3.3V
10
8
V IN = 24V
V OUT = 3.3V TEMPERATURE
DE-RATING
10
9
0 LFM
200 LFM
400 LFM
8
7
6
6
4
8
7
6
5
4
40
0 LFM
200 LFM
400 LFM
50 60
70
80 90
100
2
0
50
0 LFM
200 LFM
400 LFM
60
70
80
90
5 V IN = 24V
V OUT = 3.3V TEMPERATURE
DE-RATING
4
50 60 70
80
90
AMBIENT TEMPERATURE ( ° C)
4600hv F17
Figure 17. BGA Heatsink
Table 3. 1.5V Output
AMBIENT TEMPERATURE ( ° C)
4600hv F18.eps
Figure 18. No Heatsink
AMBIENT TEMPERATURE ( ° C)
4600hv F19.eps
Figure 19. BGA Heatsink
DERATING CURVE
Figures 9, 11, 13
Figures 9, 11, 13
Figures 9, 11, 13
Figures 10, 12, 14
Figures 10, 12, 14
Figures 10, 12, 14
V IN (V)
5, 12, 18
5, 12, 18
5, 12, 18
5, 12, 18
5, 12, 18
5, 12, 18
POWER LOSS CURVE
Figure 8
Figure 8
Figure 8
Figure 8
Figure 8
Figure 8
AIR FLOW (LFM)
0
200
400
0
200
400
HEATSINK
None
None
None
BGA Heatsink
BGA Heatsink
BGA Heatsink
θ JA (°C/W)
15.2
14
12
13.9
11.3
10.25
Table 4. 3.3V Output
DERATING CURVE
Figures 16, 18
Figures 16, 18
Figures 16, 18
Figures 17, 19
Figures 17, 19
Figures 17, 19
V IN (V)
12, 24
12, 24
12, 24
12, 24
12, 24
12, 24
POWER LOSS CURVE
Figure 15
Figure 15
Figure 15
Figure 15
Figure 15
Figure 15
AIR FLOW (LFM)
0
200
400
0
200
400
HEATSINK
None
None
None
BGA Heatsink
BGA Heatsink
BGA Heatsink
θ JA (°C/W)
15.2
14.6
13.4
13.9
11.1
10.5
4600hvfc
16
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