参数资料
型号: LTM4600IV#PBF
厂商: Linear Technology
文件页数: 14/24页
文件大小: 0K
描述: IC DC/DC UMODULE 10A 104-LGA
产品培训模块: Power Module vs. Discrete DC to DC
软件下载: LTM4600 Spice Model
产品目录绘图: LTM Series_15x15x2.8
设计资源: DC823B-A Design Files
LTM4600IV#PBF Footprint.bxl
特色产品: μModule Products
标准包装: 119
系列: µModule®
类型: 非隔离(POL)
输出数: 1
电压 - 输入(最小): 4.5V
电压 - 输入(最大): 20V
Voltage - Output 1: 0.6 ~ 5 V
电流 - 输出(最大): 10A
安装类型: 表面贴装
封装/外壳: 104-LGA
尺寸/尺寸: 0.59" L x 0.59" W x 0.11" H(15.0mm x 15.0mm x 2.8mm)
包装: 托盘
工作温度: -40°C ~ 85°C
效率: 92%
产品目录页面: 2711 (CN2011-ZH PDF)
配用: DC823B-A-ND - BOARD EVAL LTM4600
LTM4600
APPLICATIONS INFORMATION
temperature measurements at the bench, and thermal
V IN
V IN
LTM4600
V OUT
V OUT
(20A MAX )
modeling analysis. Application Note 103 provides a detailed
explanation of the analysis for the thermal models, and the
PGND COMP V OSET SGND
R SET
COMP V OSET SGND
derating curves. Tables 3 and 4 provide a summary of the
equivalent θ JA for the noted conditions. These equivalent
θ JA parameters are correlated to the measured values, and
improve with air-?ow. The case temperature is maintained
V IN
LTM4600
V OUT
at 100°C or below for the derating curves. This allows for
PGND
4600 F07
Figure 7. Parallel Two μModules with Load Sharing
Thermal Considerations and Output Current Derating
The power loss curves in Figures 8 and 13 can be used
in coordination with the load current derating curves in
Figures 9 to 12, and Figures 14 to 15 for calculating an
approximate θ JA for the module with various heatsink-
ing methods. Thermal models are derived from several
Table 3. 1.5V Output
4W maximum power dissipation in the total module with
top and bottom heatsinking, and 2W power dissipation
through the top of the module with an approximate θ JC
between 6°C/W to 9°C/W. This equates to a total of 124°C
at the junction of the device.
Safety Considerations
The LTM4600 modules do not provide isolation from V IN to
V OUT . There is no internal fuse. If required, a slow blow fuse
with a rating twice the maximum input current should be
provided to protect each unit from catastrophic failure.
DERATING CURVE
Figures 9, 11
Figures 9, 11
Figures 9, 11
Figures 10, 12
Figures 10, 12
Figures 10, 12
V IN (V)
5, 12
5, 12
5, 12
5, 12
5, 12
5, 12
POWER LOSS CURVE
Figure 8
Figure 8
Figure 8
Figure 8
Figure 8
Figure 8
AIR FLOW (LFM)
0
200
400
0
200
400
HEATSINK
None
None
None
BGA Heatsink
BGA Heatsink
BGA Heatsink
θ JA (°C/W)
15.2
14
12
13.9
11.3
10.25
Table 4. 3.3V Output
DERATING CURVE
Figure 14
Figure 14
Figure 14
Figure 15
Figure 15
Figure 15
V IN (V)
12
12
12
12
12
12
POWER LOSS CURVE
Figure 13
Figure 13
Figure 13
Figure 13
Figure 13
Figure 13
AIR FLOW (LFM)
0
200
400
0
200
400
HEATSINK
None
None
None
BGA Heatsink
BGA Heatsink
BGA Heatsink
θ JA (°C/W)
15.2
14.6
13.4
13.9
11.1
10.5
4600fc
14
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