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参数资料
| 型号： | LTM8048EY#PBF |
| 厂商： | Linear Technology |
| 文件页数： | 13/20页 |
| 文件大小： | 0K |
| 描述： | IC DC/DC UMODULE LDO BGA |
| 产品培训模块： | LTM8047 and LTM8048 1.5W, 725 VDC Isolated Micromodule Converter |
| 标准包装： | 168 |
| 系列： | µModule® |
| 类型： | 隔离 |
| 输出数： | 2 |
| 电压 - 输入（最小）： | 3.1V |
| 电压 - 输入（最大）： | 32V |
| Voltage - Output 1： | 2.5 ~ 13 V |
| Voltage - Output 2： | 1.2 ~ 12 V |
| 电流 - 输出（最大）： | 440mA，300mA |
| 电压 - 隔离： | 725V |
| 特点： | 带有 UVLO |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 45-BGA |
| 尺寸/尺寸： | 0.44" L x 0.35" W x 0.19" H（11.3mm x 9.0mm x 4.9mm） |
| 包装： | 托盘 |
| 工作温度： | -40°C ~ 125°C |
LTM8048
APPLICATIONS INFORMATION
V OUT1
C OUT1
PCBLayout
Most of the headaches associated with PCB layout have
been alleviated or even eliminated by the high level of
integration of the LTM8048. The LTM8048 is neverthe-
less a switching power supply, and care must be taken to
minimize electrical noise to ensure proper operation. Even
with the high level of integration, you may fail to achieve
specified operation with a haphazard or poor layout. See
Figure 1 for a suggested layout. Ensure that the grounding
and heat sinking are acceptable.
ADJ1
LTM8048
SS
BIAS
GND
V OUT–
RUN
ADJ2 BYP
C OUT2
V OUT2 C IN V IN
THERMAL/INTERCONNECT VIAS
8048 F01
Figure 1. Layout Showing Suggested External Components,
Planes and Thermal Vias
A few rules to keep in mind are:
1. Place the R ADJ1 and R ADJ2 resistors as close as possible
to their respective pins.
2. Place the C IN capacitor as close as possible to the V IN
and GND connections of the LTM8048.
3. Place the C OUT1 capacitor as close as possible to V OUT1
and V OUT– . Likewise, place the C OUT2 capacitor as close
as possible to V OUT2 and V OUT– .
4. Place the C IN and C OUT capacitors such that their
ground current flow directly adjacent or underneath
the LTM8048.
5. Connect all of the GND connections to as large a copper
pour or plane area as possible on the top layer. Avoid
breaking the ground connection between the external
components and the LTM8048.
6. Use vias to connect the GND copper area to the board’s
internal ground planes. Liberally distribute these GND
vias to provide both a good ground connection and
thermal path to the internal planes of the printed circuit
board. Pay attention to the location and density of the
thermal vias in Figure 1. The LTM8048 can benefit from
the heat sinking afforded by vias that connect to internal
GND planes at these locations, due to their proximity
to internal power handling components. The optimum
number of thermal vias depends upon the printed
circuit board design. For example, a board might use
very small via holes. It should employ more thermal
vias than a board that uses larger holes.
Hot-Plugging Safely
The small size, robustness and low impedance of ceramic
capacitors make them an attractive option for the input
bypass capacitor of the LTM8048. However, these capaci-
tors can cause problems if the LTM8048 is plugged into a
live supply (see Linear Technology Application Note 88 for
a complete discussion). The low loss ceramic capacitor
combined with stray inductance in series with the power
source forms an underdamped tank circuit, and the volt-
age at the V IN pin of the LTM8048 can ring to more than
twice the nominal input voltage, possibly exceeding the
LTM8048’s rating and damaging the part. A similar phe-
nomenon can occur inside the LTM8048 module, at the
output of the integrated EMI filter, with the same potential
of damaging the part. If the input supply is poorly con-
trolled or the user will be plugging the LTM8048 into an
energized supply, the input network should be designed
to prevent this overshoot. This can be accomplished by
installing a small resistor in series to V IN , but the most
popular method of controlling input voltage overshoot is
adding an electrolytic bulk capacitor to the V IN or f IN net.
This capacitor’s relatively high equivalent series resistance
damps the circuit and eliminates the voltage overshoot.
The extra capacitor improves low frequency ripple filter-
ing and can slightly improve the efficiency of the circuit,
though it can be a large component in the circuit.
8048ff
For more information www.linear.com/LTM8048
13
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相关代理商/技术参数 |
参数描述 |
|---|---|
| LTM8048IY#PBF | 功能描述:IC DC/DC UMODULE LDO BGA RoHS:是 类别:电源 - 板载 >> DC DC Converters 系列:µModule® 设计资源:VI-200, VI-J00 Design Guide, Appl Manual 标准包装:1 系列:* 类型:隔离 输出数:1 电压 - 输入（最小）:100V 电压 - 输入（最大）:200V Voltage - Output 1:7.5V Voltage - Output 2:- Voltage - Output 3:- 电流 - 输出（最大）:* 电源（瓦） - 制造商系列:100W 电压 - 隔离:* 特点:* 安装类型:通孔 封装/外壳:9-SlimMod 尺寸/尺寸:4.60" L x 1.80" W x 0.52" H（116.8mm x 45.7mm x 13.2mm） 包装:散装 工作温度:-25°C ~ 85°C 效率:* 电源（瓦特）- 最大:* |
| LTM8048IY#PBF | 制造商:Linear Technology 功能描述:DC/DC CONVERTER ISOLATED FB UMODULE BG |
| LTM8048MPY#PBF | 功能描述:IC DC/DC UMODULE LDO BGA RoHS:是 类别:电源 - 板载 >> DC DC Converters 系列:µModule® 设计资源:VI-200, VI-J00 Design Guide, Appl Manual 3D 型号:VI-Jxx-xx-F4.stp VI-Jxx-xx-F4.pdf 标准包装:1 系列:* 类型:隔离 输出数:1 电压 - 输入（最小）:18V 电压 - 输入（最大）:36V Voltage - Output 1:28V Voltage - Output 2:- Voltage - Output 3:- 电流 - 输出（最大）:* 电源（瓦） - 制造商系列:25W 电压 - 隔离:* 特点:* 安装类型:通孔 封装/外壳:9 针半砖 FinMod 尺寸/尺寸:2.28" L x 1.86" W x 1.04" H（57.9mm x 47.2mm x 26.4mm） 包装:散装 工作温度:-10°C ~ 100°C 效率:* 电源（瓦特）- 最大:* |
| LTM8048MPY#PBF | 制造商:Linear Technology 功能描述:DC/DC CONVERTER ISOLATED FB UMODULE BG 制造商:Linear Technology 功能描述:DC/DC CONVERTER, ISOLATED FB UMODULE, BG |
| LTM8050EY#PBF | 制造商:Linear Technology 功能描述:DC/DC CONVERTER 0.8-24V 48W 制造商:Linear Technology 功能描述:BUCK UMODULE 58VIN 2A 2.4M 制造商:Linear Technology 功能描述:BUCK, UMODULE, 58VIN, 2A, 2.4MHZ, BGA-70 制造商:Linear Technology 功能描述:DC-DC REGULATOR, BUCK, ADJ, BGA-70, Primary Input Voltage:58V, No. of Outputs:1, 制造商:Linear Technology 功能描述:DC-DC REGULATOR, BUCK, ADJ, BGA-70, Primary Input Voltage:58V, No. of Outputs:1, Output Current:2A, No. of Pins:70, Operating Temperature Min:-40C, Operating Temperature Max:125C, MSL:MSL 3 - 168 hours, Package / Case:70-BGA , RoHS Compliant: Yes |
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