参数资料
型号: LX1554ID-TR
厂商: MICROSEMI CORP-ANALOG MIXED SIGNAL GROUP
元件分类: 稳压器
英文描述: 1 A SWITCHING CONTROLLER, 500 kHz SWITCHING FREQ-MAX, PDSO14
封装: ROHS COMPLIANT, PLASTIC, SOIC-14
文件页数: 11/18页
文件大小: 483K
代理商: LX1554ID-TR
ULTRA-LOW START-UP CURRENT, CURRENT-MODE PWM
LX1552/3/4/5
PRODUCT D A T ABOOK 1996/1997
Copyright 1994
Rev. 1.0b
2
P RODUCTIO N D ATA
S HEET
ABSOLUTE MAXIMUM RATINGS
(Note 1)
Supply Voltage (Low Impedance Source) .................................................................. 30V
Supply Voltage (I
CC < 30mA) ......................................................................... Self Limiting
Output Current ............................................................................................................. ±1A
Output Energy (Capacitive Load) ................................................................................ 5J
Analog Inputs (Pins 2, 3) ........................................................................... -0.3V to +6.3V
Error Amp Output Sink Current ............................................................................... 10mA
Power Dissipation at T
A = 25°C (DIL-8) ...................................................................... 1W
Operating Junction Temperature
Ceramic (Y Package) ............................................................................................ 150°C
Plastic (M, DM, D, PW Packages) ........................................................................ 150°C
Storage Temperature Range .................................................................... -65°C to +150°C
Lead Temperature (Soldering, 10 Seconds) ............................................................ 300°C
PACKAGE PIN OUTS
V
REF
V
CC
OUTPUT
GND
COMP
V
FB
I
SENSE
R
T/CT
1
8
27
36
45
M & Y PACKAGE
(Top View)
DM PACKAGE
(Top View)
V
REF
V
CC
OUTPUT
GND
COMP
V
FB
I
SENSE
R
T/CT
1
8
27
36
45
V
REF
N.C.
V
CC
V
C
OUTPUT
GND
PWR GND
COMP
N.C.
V
FB
N.C.
I
SENSE
N.C.
R
T/CT
1
14
2
13
3
12
4
11
5
10
69
78
D PACKAGE
(Top View)
PW PACKAGE
(Top View)
1
20
2
19
3
18
4
17
5
16
6
15
7
14
8
13
9
12
10
11
N.C.
COMP
V
FB
N.C.
I
SENSE
N.C.
R
T/CT
N.C.
V
REF
N.C.
V
CC
V
C
OUTPUT
GND
PWR GND
N.C.
M PACKAGE:
THERMAL RESISTANCE-JUNCTION TO AMBIENT,
θθθθθ
JA
95°C/W
DM PACKAGE:
THERMAL RESISTANCE-JUNCTION TO AMBIENT,
θθθθθ
JA
165°C/W
D PACKAGE:
THERMAL RESISTANCE-JUNCTION TO AMBIENT,
θθθθθ
JA
120°C/W
Y PACKAGE:
THERMAL RESISTANCE-JUNCTION TO AMBIENT,
θθθθθ
JA
130°C/W
PW PACKAGE:
THERMAL RESISTANCE-JUNCTION TO AMBIENT,
θθθθθ
JA
144°C/W
Junction Temperature Calculation:
T
J
= T
A
+ (P
D
x
θ
JA
).
The
θ
JA
numbers are guidelines for the thermal performance of the device/pc-board system.
All of the above assume no ambient airflow
THERMAL DATA
Note 1. Exceeding these ratings could cause damage to the device. All voltages are with respect
to Ground. Currents are positive into, negative out of the specified terminal. Pin
numbers refer to DIL packages only.
Pb-free / RoHS Peak Package Solder Reflow Temp. (40 second max. exposure)................ 260°C (+0, -5)
RoHS / Pb-free 100% Matte Tin Lead Finish
M Package RoHS / Pb-free 100% Matte Tin Lead Finish
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