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参数资料
| 型号： | LX1677-CPWT |
| 厂商： | MICROSEMI CORP-ANALOG MIXED SIGNAL GROUP |
| 元件分类： | 稳压器 |
| 英文描述： | 1.5 A SWITCHING CONTROLLER, 1100 kHz SWITCHING FREQ-MAX, PDSO38 |
| 封装： | PLASTIC, TSSOP-38 |
| 文件页数： | 9/16页 |
| 文件大小： | 353K |
| 代理商： | LX1677-CPWT |
LX1677
PRELIMINARY DATA SHEET
Microsemi
Integrated Products Division
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
Page 2
WWW
.Microse
m
i
.CO
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AMD64 Processor VRM Controller
I N T E GR A T ED
PRODUCT S
Copyright
2000
Rev 0.4a, 2003-03-03
ABSOLUTE MAXIMUM RATINGS
Supply Input Voltage (VCCL, VCC)................................................-0.3V to 6.0V
Battery Input Voltage (VIN)..............................................................-0.3V to 36V
Current Limit Sense (ILIM1, ILIM3) ................................................-0.3V to 36V
Topside Driver Supply Input Voltage (VC1, VC2, VC3)........ -0.3 to VSx + 6.0V
Topside Driver Return Input Voltage (VS1, VS2)................................-5V to 36V
Differential Sense Input Voltage (FB+, FB-)....................................-0.3V to 6.0V
VID0 – VID4, Input Voltage ...............................................................-0.3V to 6V
High Side Driver Peak (<500ns) Current (HO1/2, I-MAX) ............................+1A
Low Side Driver Peak (<500ns) Sink Current (LO1/2, I-MIN)....................+1.5A
Operating Junction Temperature.................................................................. 150
°C
Storage Temperature Range...........................................................-65
°C to 150°C
Lead Temperature (Soldering 10 seconds) .................................................. 300
°C
Note: Exceeding these ratings could cause damage to the device. All voltages are with respect to
Ground. Currents are positive into, negative out of specified terminal
.
x denotes respective pin designator 1, 2, or 3
TH ERMAL DATA
LQ Plastic MLPQ 38-Pin
THERMAL RESISTANCE
-JUNCTION TO CASE,
θ
JC
8
°C/W
THERMAL RESISTANCE
-JUNCTION TO AMBIENT,
θ
JA
35
°C/W
PW Plastic TSSOP 38-Pin
THERMAL RESISTANCE
-JUNCTION TO CASE,
θ
JC
12.2
°C/W
THERMAL RESISTANCE
-JUNCTION TO AMBIENT,
θ
JA
38
°C/W
Junction Temperature Calculation: TJ = TA + (PD x θJA).
The
θJA numbers are guidelines for the thermal performance of the device/pc-board system. All of the
above assume no ambient airflow.
PACKAGE PIN OUT
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
FB-
DFOUT
EO1
EA1-
DACOUT
PWGD
GND
ROSC
ENA
VID4
VID3
PGN3
I-MIN
VCCL
LO2
PGN
LO1
VS1
HO1
VC1
VC3
I-MAX
IL
IM
3
IL
IM
1
LP
1
LP
2
EA2-
EO
2
FB+
VI
D
2
VI
D
1
VI
D
0
VS2
HO
2
VC
2
VCC
VIN
VS3
Connect Bottom to
Power GND
LQ PACKAGE
(Top View)
1
19
38
20
FB-
DFOUT
EO1
EA1-
DACOUT
PWGD
GND
VIN
ROSC
ENA
VID4
VID3
VID2
VID1
VID0
VS2
H02
VC2
VCC
PGN3
I-MIN
VCCL
LO2
PGN
LO1
VC1
VC3
VS3
ILIM3
ILIM1
LP1
LP2
EA2-
EO2
FB+
VS1
HO1
I-MAX
PW PACKAGE
(Top View)
RECOMM END E D O P ERATING CONDITIONS
LX1677
Parameter
Symbol
Min
Typ
Max
Units
IC Input Supply Voltage
VCC
4.5
5.5
V
Battery Input Voltage
VIN
5.7
25.2
V
Biphase Topside Driver Return Voltage
VS1, VS2
0
25.2
V
Transient Correction Phase Driver Return Voltage
VS3
0
5.5
V
PP
AA
CC
KK
AA
GG
EE
DD
AA
TT
AA
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