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参数资料
| 型号： | LX1732CDUT |
| 厂商： | MICROSEMI CORP-ANALOG MIXED SIGNAL GROUP |
| 元件分类： | 稳压器 |
| 英文描述： | 1 A SWITCHING REGULATOR, 135 kHz SWITCHING FREQ-MAX, PDSO8 |
| 封装： | PLASTIC, MSOP-8 |
| 文件页数： | 5/12页 |
| 文件大小： | 450K |
| 代理商： | LX1732CDUT |
Microsemi
Integrated Products
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
Page 2
Copyright
2000
Rev. 1.1, 2003-07-29
WWW
.Microse
m
i
.CO
M
LX1732
High Current PFM Boost Converter
PRODUCTION DATA SHEET
I N T E GRA T ED
PR ODUC T S
ABSOLUTE MAXIMUM RATINGS
Supply Voltage (VIN) ........................................................................-0.3V to 7.0V
Output Voltage (VC) .........................................................................-0.3V to 7.0V
Switch Voltage (VSW) .......................................................................-0.3V to 7.0V
Shutdown Input Voltage (V
SHDN ) ......................................... -0.3V to (VC + 0.3V)
Low Battery Detect Output (VLBO) ...................................... -0.3V to (VC + 0.3V)
Low Battery Detect Input Voltage (VLBI) .............................. -0.3V to (VC+ 0.3V)
Feedback Input Voltage (VFB) ............................................... -0.3V to (VC+ 0.3V)
Switch Current (ILX).................................................................................. 1.0ARMS
Operating Temperature Range ............................................................ 0
°C to 70°C
Operating Junction Temperature.................................................................. 150
°C
Storage Temperature Range...........................................................-65
°C to 150°C
Lead Temperature (Soldering 10 seconds) .................................................. 300
°C
Note: Exceeding these ratings could cause damage to the device. All voltages are with respect to
Ground. Currents are positive into, negative out of specified terminal
.
TH ERMAL DATA
DU
Plastic MSOP 8-Pin
THERMAL RESISTANCE
-JUNCTION TO AMBIENT,
θ
JA
206
°C/W
THERMAL RESISTANCE
-JUNCTION TO CASE,
θ
JC
39
°C/W
Junction Temperature Calculation: TJ = TA + (PD x θJC).
The
θJA numbers are guidelines for the thermal performance of the device/pc-board
system. All of the above assume no ambient airflow.
PACKAGE PIN OUT
1
2
4
3
5
6
8
7
SW
LBI
VIN
VC
GND
FB
LBO
SHDN
DU PACKAGE
(Top View)
FUNCTIONAL PIN DESCRIPTION
NAME
DESCRIPTION
IN
Unregulated IC Supply Voltage Input – Input range from +1.1V to 5.5V. Bypass with a 4.7
F or greater capacitor.
FB
Control pin for output voltage programming. Connect this pin to a resistive divider network between the output
and GND to obtain an output voltage between 2.0V and 5.5V.
SHDN
Active-Low Shutdown Input – A logic low shuts down the device and reduces the supply current to 0.1
A.
Connect SHDN to VCC for normal operation.
SW
Inductor Switching Connection – Internally connected to the drain of an N-channel MOSFET.
VC
Output voltage control pin: Connect this pin to the circuit load and cathode of the switching diode.
GND
Common terminal for ground reference.
LBI
Low Battery Detect Comparator Input – Connect to a resistive divider network between the VCC and GND to set
the Low Battery Detect trip point. The LBI threshold is 0.6V.
LBO
Low Battery Detect Comparator Output – Open drain comparator output. This output is pulled low when VLBI is
less than 0.6V. LBO is high impedance during shutdown.
PP
AA
CC
KK
AA
GG
EE
DD
AA
TT
AA
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