参数资料
型号: M1A3PE3000-2FGG324
厂商: Microsemi SoC
文件页数: 63/162页
文件大小: 0K
描述: IC FPGA 1KB FLASH 3M 324-FBGA
标准包装: 84
系列: ProASIC3E
RAM 位总计: 516096
输入/输出数: 221
门数: 3000000
电源电压: 1.425 V ~ 1.575 V
安装类型: 表面贴装
工作温度: 0°C ~ 70°C
封装/外壳: 324-BGA
供应商设备封装: 324-FBGA(19x19)
ProASIC3E Flash Family FPGAs
Revision 13
5-5
Revision 3 (Apr 2008)
Packaging v1.2
The following pins had duplicates and the extra pins were deleted from the
"PQ208" A3PE3000 table:
36, 62, 171
Note: There were no pin function changes in this update.
The following pins had duplicates and the extra pins were deleted from the
"FG324" table:
E2, E3, E16, E17, P2, P3, T16, U17
Note: There were no pin function changes in this update.
The "FG256" pin table was updated for the A3PE600 device because the old PAT
were based on the IFX die, and this is the final UMC die version.
The "FG484" was updated for the A3PE600 device because the old PAT were
based on the IFX die, and this is the final UMC die version.
The following pins had duplicates and the extra pins were deleted from the
"FG896" table:
AD6, AE5, AE28, AF29, F5, F26, G6, G25
Note: There were no pin function changes in this update.
Revision 2 (Mar 2008)
Product Brief rev. 1
The FG324 package was added to the "ProASIC3E Product Family" table, the
A3PE3000.
I, II, IV
Revision 1 (Feb 2008)
DC
and
Switching
Characteristics v1.1
Temperature 1, Maximum Operating Junction Temperature was changed from
110°C to 100°C for both commercial and industrial grades.
In the "PLL Contribution—PPLL" section, the following was deleted:
FCLKIN is the input clock frequency.
was incorrect. It previously said TJ and it was corrected and changed to TA.
In Table 2-98 ProASIC3E CCC/PLL Specification, the SCLK parameter and note
1 are new.
Table 2-103 JTAG 1532 was populated with the parameter data, which was not
in the previous version of the document.
Revision 1 (cont’d)
Packaging v1.1
The "PQ208" pin table for A3PE3000 was updated.
The "FG324" pin table for A3PE3000 is new.
The "FG484" pin table for A3PE3000 is new.
The "FG896" pin table for A3PE3000 is new.
Revision 0 (Jan 2008) This document was previously in datasheet v2.1. As a result of moving to the
handbook format, Actel has restarted the version numbers. The new version
number is 51700098-001-0.
N/A
v2.1
(July 2007)
CoreMP7 information was removed from the "Features and Benefits" section.
i
The M1 device part numbers have been updated in Table 4 ProASIC3E
Product Family, "Packaging Tables", "Temperature Grade Offerings", "Speed
Grade and Temperature Grade Matrix", and "Speed Grade and Temperature
Grade Matrix".
ii, iii,
iv, iv
Revision
Changes
Page
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相关代理商/技术参数
参数描述
M1A3PE3000-2FGG324I 功能描述:IC FPGA 1KB FLASH 3M 324-FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:ProASIC3E 标准包装:1 系列:ProASICPLUS LAB/CLB数:- 逻辑元件/单元数:- RAM 位总计:129024 输入/输出数:248 门数:600000 电源电压:2.3 V ~ 2.7 V 安装类型:表面贴装 工作温度:- 封装/外壳:352-BFCQFP,带拉杆 供应商设备封装:352-CQFP(75x75)
M1A3PE3000-2FGG484 功能描述:IC FPGA 1KB FLASH 3M 484-FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:ProASIC3E 产品培训模块:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 特色产品:Cyclone? IV FPGAs 标准包装:60 系列:CYCLONE® IV GX LAB/CLB数:9360 逻辑元件/单元数:149760 RAM 位总计:6635520 输入/输出数:270 门数:- 电源电压:1.16 V ~ 1.24 V 安装类型:表面贴装 工作温度:0°C ~ 85°C 封装/外壳:484-BGA 供应商设备封装:484-FBGA(23x23)
M1A3PE3000-2FGG484I 功能描述:IC FPGA 1KB FLASH 3M 484-FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:ProASIC3E 标准包装:1 系列:ProASICPLUS LAB/CLB数:- 逻辑元件/单元数:- RAM 位总计:129024 输入/输出数:248 门数:600000 电源电压:2.3 V ~ 2.7 V 安装类型:表面贴装 工作温度:- 封装/外壳:352-BFCQFP,带拉杆 供应商设备封装:352-CQFP(75x75)
M1A3PE3000-2FGG896 功能描述:IC FPGA 1KB FLASH 3M 896-FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:ProASIC3E 产品培训模块:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 特色产品:Cyclone? IV FPGAs 标准包装:60 系列:CYCLONE® IV GX LAB/CLB数:9360 逻辑元件/单元数:149760 RAM 位总计:6635520 输入/输出数:270 门数:- 电源电压:1.16 V ~ 1.24 V 安装类型:表面贴装 工作温度:0°C ~ 85°C 封装/外壳:484-BGA 供应商设备封装:484-FBGA(23x23)
M1A3PE3000-2FGG896ES 制造商:ACTEL 制造商全称:Actel Corporation 功能描述:ProASIC3E Flash Family FPGAs