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参数资料
型号： M1A3PE3000L-FG896I
厂商： Microsemi SoC
文件页数： 124/162页
文件大小： 0K
描述： IC FPGA 1KB FLASH 3M 896-FBGA
标准包装： 27
系列： ProASIC3EL
RAM 位总计： 516096
输入/输出数： 620
门数： 3000000
电源电压： 1.14V ~ 1.575 V
安装类型： 表面贴装
工作温度： -40°C ~ 85°C
封装/外壳： 896-BGA
供应商设备封装： 896-FBGA（31x31）
ProASIC3E DC and Switching Characteristics
2-50
Revision 13
Timing Characteristics
B-LVDS/M-LVDS
Bus LVDS (B-LVDS) and Multipoint LVDS (M-LVDS) specifications extend the existing LVDS standard to
high-performance multipoint bus applications. Multidrop and multipoint bus configurations may contain
any combination of drivers, receivers, and transceivers. Microsemi LVDS drivers provide the higher drive
current required by B-LVDS and M-LVDS to accommodate the loading. The drivers require series
terminations for better signal quality and to control voltage swing. Termination is also required at both
ends of the bus since the driver can be located anywhere on the bus. These configurations can be
implemented using the TRIBUF_LVDS and BIBUF_LVDS macros along with appropriate terminations.
Multipoint designs using Microsemi LVDS macros can achieve up to 200 MHz with a maximum of 20
loads. A sample application is given in Figure 2-23. The input and output buffer delays are available in
the LVDS section in Table 2-80.
Example: For a bus consisting of 20 equidistant loads, the following terminations provide the required
differential voltage, in worst-case Industrial operating conditions, at the farthest receiver: RS =60 and
RT =70 , given Z0 =50 (2") and Zstub =50 (~1.5").
Table 2-80 LVDS
Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case
VCCI = 2.3 V
Speed Grade
tDOUT
tDP
tDIN
tPY
Units
Std.
0.66
1.87
0.04
1.82
ns
–1
0.56
1.59
0.04
1.55
ns
–2
0.49
1.40
0.03
1.36
ns
Note: For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-5 for
derating values.
Figure 2-23 B-LVDS/M-LVDS Multipoint Application Using LVDS I/O Buffers
...
RT
BIBUF_LVDS
R
+
-
T
+
-
R
+
-
T
+
-
D
+
-
EN
Receiver
Transceiver
Receiver
Transceiver
Driver
RS RS
Zstub
Z0
相关PDF资料
PDF描述
APA750-FGG896I IC FPGA PROASIC+ 750K 896-FBGA
ASM43DRSN-S288 CONN EDGECARD 86POS .156 EXTEND
AGM43DRSN-S288 CONN EDGECARD EXTEND 86POS .156
AYM43DRSH-S288 CONN EDGECARD 86POS .156 EXTEND
ASM43DRSH-S288 CONN EDGECARD 86POS .156 EXTEND
相关代理商/技术参数
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M1A3PE3000L-FGG484 功能描述:IC FPGA 1KB FLASH 3M 484-FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:ProASIC3EL 产品培训模块:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 特色产品:Cyclone? IV FPGAs 标准包装:60 系列:CYCLONE® IV GX LAB/CLB数:9360 逻辑元件/单元数:149760 RAM 位总计:6635520 输入/输出数:270 门数:- 电源电压:1.16 V ~ 1.24 V 安装类型:表面贴装 工作温度:0°C ~ 85°C 封装/外壳:484-BGA 供应商设备封装:484-FBGA（23x23）
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