参数资料
型号: M1A3PE3000L-FG896I
厂商: Microsemi SoC
文件页数: 153/162页
文件大小: 0K
描述: IC FPGA 1KB FLASH 3M 896-FBGA
标准包装: 27
系列: ProASIC3EL
RAM 位总计: 516096
输入/输出数: 620
门数: 3000000
电源电压: 1.14V ~ 1.575 V
安装类型: 表面贴装
工作温度: -40°C ~ 85°C
封装/外壳: 896-BGA
供应商设备封装: 896-FBGA(31x31)
ProASIC3E DC and Switching Characteristics
2-76
Revision 13
Table 2-100 RAM512X18
Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V
Parameter
Description
–2
–1
Std. Units
tAS
Address setup time
0.25 0.28 0.33
ns
tAH
Address hold time
0.00 0.00 0.00
ns
tENS
REN, WEN setup time
0.18 0.20 0.24
ns
tENH
REN, WEN hold time
0.06 0.07 0.08
ns
tDS
Input data (WD) setup time
0.18 0.21 0.25
ns
tDH
Input data (WD) hold time
0.00 0.00 0.00
ns
tCKQ1
Clock High to new data valid on RD (output retained)
2.16 2.46 2.89
ns
tCKQ2
Clock High to new data valid on RD (pipelined)
0.90 1.02 1.20
ns
tC2CRWH1
Address collision clk-to-clk delay for reliable read access after write on same
address—Applicable to Opening Edge
0.50 0.43 0.38
ns
tC2CWRH1
Address collision clk-to-clk delay for reliable write access after read on same
address— Applicable to Opening Edge
0.59 0.50 0.44
ns
tRSTBQ
RESET Low to data out Low on RD (flow-through)
0.92 1.05 1.23
ns
RESET Low to data out Low on RD (pipelined)
0.92 1.05 1.23
ns
tREMRSTB
RESET removal
0.29 0.33 0.38
ns
tRECRSTB
RESET recovery
1.50 1.71 2.01
ns
tMPWRSTB
RESET minimum pulse width
0.21 0.24 0.29
ns
tCYC
Clock cycle time
3.23 3.68 4.32
ns
FMAX
Maximum frequency
310
272
231
MHz
Notes:
1. For more information, refer to the application note Simultaneous Read-Write Operations in Dual-Port SRAM for Flash-
2. For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-5 for derating values.
相关PDF资料
PDF描述
APA750-FGG896I IC FPGA PROASIC+ 750K 896-FBGA
ASM43DRSN-S288 CONN EDGECARD 86POS .156 EXTEND
AGM43DRSN-S288 CONN EDGECARD EXTEND 86POS .156
AYM43DRSH-S288 CONN EDGECARD 86POS .156 EXTEND
ASM43DRSH-S288 CONN EDGECARD 86POS .156 EXTEND
相关代理商/技术参数
参数描述
M1A3PE3000L-FG896M 制造商:Microsemi Corporation 功能描述:FPGA ProASIC?3EL Family 3M Gates 130nm Technology 1.2V/1.5V 896-Pin FBGA 制造商:Microsemi Corporation 功能描述:FPGA PROASIC?3EL FAMILY 3M GATES 130NM (CMOS) TECHNOLOGY 1.2 - Trays 制造商:Microsemi Corporation 功能描述:IC FPGA 3M GATES W/M1 896FBGA 制造商:Microsemi Corporation 功能描述:IC FPGA 620 I/O 896FBGA
M1A3PE3000L-FGG144M 制造商:ACTEL 制造商全称:Actel Corporation 功能描述:Military ProASIC3/EL Low-Power Flash FPGAs
M1A3PE3000L-FGG324I 制造商:Microsemi Corporation 功能描述:FPGA PROASIC3EL 3M GATES 781.25MHZ 130NM 1.2V 324FBGA - Trays 制造商:Microsemi SOC Products Group 功能描述:FPGA PROASIC3EL 3M GATES 781.25MHZ 130NM 1.2V 324FBGA - Trays
M1A3PE3000L-FGG484 功能描述:IC FPGA 1KB FLASH 3M 484-FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:ProASIC3EL 产品培训模块:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 特色产品:Cyclone? IV FPGAs 标准包装:60 系列:CYCLONE® IV GX LAB/CLB数:9360 逻辑元件/单元数:149760 RAM 位总计:6635520 输入/输出数:270 门数:- 电源电压:1.16 V ~ 1.24 V 安装类型:表面贴装 工作温度:0°C ~ 85°C 封装/外壳:484-BGA 供应商设备封装:484-FBGA(23x23)
M1A3PE3000L-FGG484I 功能描述:IC FPGA 1KB FLASH 3M 484-FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:ProASIC3EL 标准包装:1 系列:ProASICPLUS LAB/CLB数:- 逻辑元件/单元数:- RAM 位总计:129024 输入/输出数:248 门数:600000 电源电压:2.3 V ~ 2.7 V 安装类型:表面贴装 工作温度:- 封装/外壳:352-BFCQFP,带拉杆 供应商设备封装:352-CQFP(75x75)