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参数资料
| 型号： | M1MA152/2AT3 |
| 厂商： | ON SEMICONDUCTOR |
| 元件分类： | 二极管(射频、小信号、开关、功率) |
| 英文描述： | 0.1 A, 80 V, SILICON, SIGNAL DIODE |
| 封装： | SC-59, 3 PIN |
| 文件页数： | 4/4页 |
| 文件大小： | 138K |
| 代理商： | M1MA152/2AT3 |
M1MA151AT1, M1MA152AT1
http://onsemi.com
685
STEP 1
PREHEAT
ZONE 1
RAMP"
STEP 2
VENT
SOAK"
STEP 3
HEATING
ZONES 2 & 5
RAMP"
STEP 4
HEATING
ZONES 3 & 6
SOAK"
STEP 5
HEATING
ZONES 4 & 7
SPIKE"
STEP 6
VENT
STEP 7
COOLING
200°C
150°C
100°C
50°C
TIME (3 TO 7 MINUTES TOTAL)
TMAX
SOLDER IS LIQUID FOR
40 TO 80 SECONDS
(DEPENDING ON
MASS OF ASSEMBLY)
205° TO 219°C
PEAK AT
SOLDER JOINT
DESIRED CURVE FOR LOW
MASS ASSEMBLIES
100°C
150°C
160°C
140°C
Figure 2. Typical Solder Heating Profile
DESIRED CURVE FOR HIGH
MASS ASSEMBLIES
170°C
For any given circuit board, there will be a group of con-
trol settings that will give the desired heat pattern. The op-
erator must set temperatures for several heating zones, and
a figure for belt speed. Taken together, these control set-
tings make up a heating “profile” for that particular circuit
board. On machines controlled by a computer, the comput-
er remembers these profiles from one operating session to
the next. Figure 7 shows a typical heating profile for use
when soldering a surface mount device to a printed circuit
board. This profile will vary among soldering systems but
it is a good starting point. Factors that can affect the profile
include the type of soldering system in use, density and
types of components on the board, type of solder used, and
the type of board or substrate material being used. This pro-
file
shows
temperature
versus
time.
SOLDER STENCIL GUIDELINES
Prior to placing surface mount components onto a printed
circuit board, solder paste must be applied to the pads. A
solder stencil is required to screen the optimum amount of
solder paste onto the footprint. The stencil is made of brass
or stainless steel with a typical thickness of 0.008 inches.
The stencil opening size for the surface mounted package
should be the same as the pad size on the printed circuit
board, i.e., a 1:1 registration.
TYPICAL SOLDER HEATING PROFILE
The line on the graph shows the actual temperature that
might be experienced on the surface of a test board at or
near a central solder joint. The two profiles are based on a
high density and a low density board. The Vitronics
SMD310 convection/infrared reflow soldering system was
used to generate this profile. The type of solder used was
62/36/2 Tin Lead Silver with a melting point between
177 189
°C. When this type of furnace is used for solder re-
flow work, the circuit boards and solder joints tend to heat
first. The components on the board are then heated by con-
duction. The circuit board, because it has a large surface
area, absorbs the thermal energy more efficiently, then dis-
tributes this energy to the components. Because of this ef-
fect, the main body of a component may be up to 30 degrees
cooler than the adjacent solder joints.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| M1MA152A | 制造商:SECOS 制造商全称:SeCoS Halbleitertechnologie GmbH 功能描述:Surface Mount Switching Diode |
| M1MA152AT1 | 功能描述:二极管 - 通用，功率，开关 80V 100mA RoHS:否 制造商:STMicroelectronics 产品:Switching Diodes 峰值反向电压:600 V 正向连续电流:200 A 最大浪涌电流:800 A 配置: 恢复时间:2000 ns 正向电压下降:1.25 V 最大反向漏泄电流:300 uA 最大功率耗散: 工作温度范围: 安装风格:SMD/SMT 封装 / 箱体:ISOTOP 封装:Tube |
| M1MA152AT1G | 功能描述:二极管 - 通用，功率，开关 80V 100mA RoHS:否 制造商:STMicroelectronics 产品:Switching Diodes 峰值反向电压:600 V 正向连续电流:200 A 最大浪涌电流:800 A 配置: 恢复时间:2000 ns 正向电压下降:1.25 V 最大反向漏泄电流:300 uA 最大功率耗散: 工作温度范围: 安装风格:SMD/SMT 封装 / 箱体:ISOTOP 封装:Tube |
| M1MA152K | 制造商:SECOS 制造商全称:SeCoS Halbleitertechnologie GmbH 功能描述:Surface Mount Switching Diode |
| M1MA152KT1 | 功能描述:二极管 - 通用，功率，开关 80V 100mA RoHS:否 制造商:STMicroelectronics 产品:Switching Diodes 峰值反向电压:600 V 正向连续电流:200 A 最大浪涌电流:800 A 配置: 恢复时间:2000 ns 正向电压下降:1.25 V 最大反向漏泄电流:300 uA 最大功率耗散: 工作温度范围: 安装风格:SMD/SMT 封装 / 箱体:ISOTOP 封装:Tube |
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