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参数资料
| 型号： | M306N4FCTGP |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 16-BIT, FLASH, 20 MHz, MICROCONTROLLER, PQFP100 |
| 封装： | 14 X 14 MM, 0.50 MM PITCH, PLASTIC, LQFP-100 |
| 文件页数： | 90/92页 |
| 文件大小： | 694K |
| 代理商： | M306N4FCTGP |
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REVISION HISTORY
M16C/6N Group (M16C/6N4) Data Sheet
Rev.
Date
Description
Page
Summary
A-2
34
Table 5.6 A/D Conversion Characteristics: "Tolerance Level Impedance" is added.
35
Table 5.8 Power Supply Circuit Timing Characteristics: "td(M-L)" is deleted.
Figure 5.2 Power Supply Circuit Timing Diagram is added.
36
Table 5.10 Memory Expansion Mode and Microprocessor Mode: "td(BCLK-HLDA)" is deleted.
38
Table 5.21 Serial I/O: Min. of standard in tsu(D-C) is revised from "30" to "70".
39
Table 5.23 Memory Expansion Mode and Microprocessor Mode (for setting with no wait)
Max. of Standard in td(BCLK-ALE) is revised from "25" to "15".
td(BCLK-HLDA) is added.
40
Table 5.24 Memory Expansion Mode and Microprocessor Mode (for 1- to 3-wait setting
and external area access)
Max. of Standard in td(BCLK-ALE) is revised from "25" to "15".
td(BCLK-HLDA) is added.
41
Table 5.25 Memory Expansion Mode and Microprocessor Mode (for 2- to 3-wait setting,
external area access and multiplexed bus selection)
td(BCLK-HLDA) is added.
Max. of Standard in td(BCLK-ALE) is revised from "25" to "15".
42
Figure 5.4 Timing Diagram (1): "XIN input" is added.
44, 45
Figures 5.6 and 5.7 Timing Diagram (3) (4): "DB" in Read timing is revised to "DBi".
46, 47
Figures 5.8 and 5.9 Timing Diagram (5) (6): "DB" in Write timing is revised to "DBi".
49
Figure 5.11 Timing Diagram (8)
"ADi/DB" in Read/Write timing is revised to "ADi/DBi".
50
Appendix 1. Package Dimensions: 100P6Q-A is added.
–
Revised edition issued
* The contents of product are revised. (Normal-ver. is added.)
* Revised parts and revised contents are as follows (except for expressional change).
2
Table 1.1 Performance outline of M16C/6N Group (M16C/6N4)
Performance outline of Normal-ver. is added.
4
Table 1.2 Product List is revised. (Normal-ver. is added.)
Figure 1.2 Type No., Memory Size, and Package:
"(no): Normal-ver." is added to Characteristics.
19
Figure 4.7 SFR Information (7): NOTE 1 is revised.
32
Table 5.4 Electrical Characteristics (1)
Measuring Condition of VOL is revised from “LOL = –200A” to “LOL = 200A”.
33
Table 5.5 Electrical Characteristics (2): Mask ROM (5th item)
“f(XCIN)” is changed to “(f(BCLK)).
34
Table 5.6 A/D Conversion Characteristics: “Tolerance Level Impedance” is deleted.
–
Revised edition issued
* Electric Characteristics of Normal-ver. is added.
* Revised parts and revised contents are as follows (except for expressional change).
1
1.1 Applications: Comment of Normal-ver. is added.
4
Table 1.2 Product Information
Status of development is revised and NOTES 1 and 2 are added.
2.00 Nov. 10, 2004
2.10 Jun. 24, 2005
2.40 Aug. 25, 2006
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相关代理商/技术参数 |
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| M306N4FCVFP | 制造商:RENESAS 制造商全称:Renesas Technology Corp 功能描述:Renesas MCU |
| M306N4FCVGP | 制造商:RENESAS 制造商全称:Renesas Technology Corp 功能描述:Renesas MCU |
| M306N4FCVGP#U0 | 功能描述:MCU FLASH 128K 5K 100-LQFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - 微控制器， 系列:M16C™ M16C/60/6N4 标准包装:96 系列:PIC® 16F 核心处理器:PIC 芯体尺寸:8-位 速度:20MHz 连通性:I²C，SPI 外围设备:欠压检测/复位，POR，PWM，WDT 输入/输出数:11 程序存储器容量:3.5KB（2K x 14） 程序存储器类型:闪存 EEPROM 大小:- RAM 容量:128 x 8 电压 - 电源 (Vcc/Vdd):2.3 V ~ 5.5 V 数据转换器:A/D 8x10b 振荡器型:内部 工作温度:-40°C ~ 125°C 封装/外壳:14-TSSOP（0.173"，4.40mm 宽） 包装:管件 |
| M306N4FGFP | 制造商:RENESAS 制造商全称:Renesas Technology Corp 功能描述:Renesas MCU |
| M306N4FGGP | 制造商:Renesas Electronics Corporation 功能描述: |
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