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参数资料
| 型号： | M470L6524CU0-CB3 |
| 厂商： | SAMSUNG SEMICONDUCTOR CO. LTD. |
| 英文描述： | DDR SDRAM Unbuffered Module 18 4 pin Unbuffered Module based on 512Mb C-die |
| 中文描述： | DDR SDRAM的缓冲模块18 4针缓冲模块的基于C的512Mb芯片 |
| 文件页数： | 15/17页 |
| 文件大小： | 225K |
| 代理商： | M470L6524CU0-CB3 |
DDR SDRAM
256MB, 512MB Unbuffered SODIMM
Rev. 1.2 June 2005
(V=Valid, X=Don
′
t Care, H=Logic High, L=Logic Low)
16.0 Command Truth Table
Note :
1. OP Code : Operand Code. A
0
~ A
12
& BA
0
~ BA
1
: Program keys. (@EMRS/MRS)
2. EMRS/ MRS can be issued only at all banks precharge state. A new command can be issued 2 clock cycles after EMRS or MRS.
3. Auto refresh functions are same as the CBR refresh of DRAM.
The automatical precharge without row precharge command is meant by "Auto".
Auto/self refresh can be issued only at all banks precharge state.
4. BA
0
~ BA
1
: Bank select addresses.
If both BA
0
and BA
1
are "Low" at read, write, row active and precharge, bank A is selected.
If BA
0
is "High" and BA
1
is "Low" at read, write, row active and precharge, bank B is selected.
If BA
0
is "Low" and BA
1
is "High" at read, write, row active and precharge, bank C is selected.
If both BA
0
and BA
1
are "High" at read, write, row active and precharge, bank D is selected.
5. If A
10
/AP is "High" at row precharge, BA
0
and BA
1
are ignored and all banks are selected.
6. During burst write with auto precharge, new read/write command can not be issued.
Another bank read/write command can be issued after the end of burst.
New row active of the associated bank can be issued at t
RP
after the end of burst.
7. Burst stop command is valid at every burst length.
8. DM sampled at the rising and falling edges of the DQS and Data-in are masked at the both edges (Write DM latency is 0).
9. This combination is not defined for any function, which means "No Operation(NOP)" in DDR SDRAM.
COMMAND
CKEn-1
CKEn
CS
RAS
CAS
WE
BA0,1
A10/AP
A0 ~ A9
A11, A12
Note
Register
Register
Extended MRS
Mode Register Set
Auto Refresh
H
H
X
X
H
L
L
L
L
L
L
L
L
L
OP CODE
OP CODE
1, 2
1, 2
3
3
3
3
Refresh
H
L
L
L
H
X
Self
Refresh
Entry
Exit
L
H
L
H
H
X
H
X
H
X
X
Bank Active & Row Addr.
H
X
L
L
H
H
V
Row Address
(A0~A9, A11,A12)
L
H
L
H
X
L
H
Read &
Column Address
Auto Precharge Disable
Auto Precharge Enable
Auto Precharge Disable
Auto Precharge Enable
Burst Stop
Bank Selection
All Banks
H
X
L
H
L
H
V
Column
Address
4
4
4
Write &
Column Address
H
X
L
H
L
L
V
Column
Address
4, 6
7
H
X
L
H
H
L
Precharge
H
X
L
L
H
L
V
X
X
5
Active Power Down
Entry
H
L
H
L
X
H
L
H
L
X
V
X
X
H
X
V
X
X
H
X
V
X
X
H
X
V
X
V
X
X
H
X
V
X
Exit
L
H
Precharge Power Down Mode
Entry
H
L
X
Exit
L
H
DM
H
X
8
9
9
No operation (NOP) : Not defined
H
X
H
L
X
H
X
H
X
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相关代理商/技术参数 |
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| M470L6524CU0-CB300 | 制造商:Samsung Semiconductor 功能描述:512 DDR SDRAM MODUL X64 TSOP2-400(LF) - Trays |
| M470L6524CU0-CCC | 制造商:SAMSUNG 制造商全称:Samsung semiconductor 功能描述:DDR SDRAM Unbuffered Module 18 4 pin Unbuffered Module based on 512Mb C-die |
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| M470L6524CU0-LB0 | 制造商:SAMSUNG 制造商全称:Samsung semiconductor 功能描述:DDR SDRAM Unbuffered Module 18 4 pin Unbuffered Module based on 512Mb C-die |
| M470L6524CU0-LB3 | 制造商:SAMSUNG 制造商全称:Samsung semiconductor 功能描述:DDR SDRAM Unbuffered Module 18 4 pin Unbuffered Module based on 512Mb C-die |
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