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| 型号： | MA300014 |
| 厂商： | Microchip Technology |
| 文件页数： | 6/92页 |
| 文件大小： | 0K |
| 描述： | MODULE DSPIC30F SAMPLE 80QFP |
| 标准包装： | 1 |
| 附件类型： | 插拔式模块（PIM）- dsPIC30F6014A |
| 适用于相关产品： | dsPICDEM 板（DM300014 或 DM300019） |
| 产品目录页面： | 658 (CN2011-ZH PDF) |
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dsPIC30F
1.3
Sensor Family
have features that support high-performance, low-cost
embedded control applications. The 18- and 28-pin
packages are designed to fit space-critical applications.
TABLE 1-3:
Device
dsPIC30F SENSOR PROCESSOR FAMILY VARIANTS
Program
Memory
Pins
dsPIC30F2011
dsPIC30F3012
dsPIC30F2012
dsPIC30F3013
18
18
28
28
12K
24K
12K
24K
4K
8K
4K
8K
1024
2048
1024
2048
0
1024
0
1024
3
3
3
3
2
2
2
2
2
2
2
2
8 ch
8 ch
10 ch
10 ch
1
1
1
2
1
1
1
1
1
1
1
1
12
12
20
20
SOG, PG
SOG, PG
SOG, PG
SOG, PG
Note 1:
2:
1.4
Maximum I/O pin count includes pins shared by the peripheral functions.
All 28- and 40-pin devices may be offered in ML packages in the future, depending on die size.
Product Identification System
To order or obtain information (e.g., on pricing or
delivery), refer to the factory or a listed sales office
(sales offices and locations are listed in the back of this
document).
FIGURE 1-1:
Trademark
PART NUMBER STRUCTURE
d s P I C 3 0 F 5 0 11 AT- 3 0 I / S O G - E S
Custom ID (3 digits) or
Engineering Sample (ES)
Architecture
Flash
Memory Size in Bytes:
0 = ROMless
1 = 1K to 6K
2 = 7K to 12K
PT =
PT =
PF =
PG =
SPG=
SOG=
ML =
S =
W =
Package:
TQFP 10x10
TQFP 12x12
TQFP 14x14
DIP
SPDIP
SOIC
QFN 6x6 or 8x8
Die (Waffle Pack)
Die (Wafers)
3 = 13K to 24K
4 = 25K to 48K
5 = 49K to 96K
6 = 97K to 192K
7 = 193K to 384K
8 = 385K to 768K
9 = 769K and Up
Device ID
DS70043F-page 4
Temperature:
I = Industrial -40°C to +85°C
E = Extended High Temp -40°C to +125°C
Speed:
20 = 20 MIPS
30 = 30 MIPS
T = Tape and Reel
A,B,C… = Revision Level
? 2005 Microchip Technology Inc.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MA300015 | 功能描述:子卡和OEM板 dsPIC30F 80L Plug In Sample (6010A). RoHS:否 制造商:BeagleBoard by CircuitCo 产品:BeagleBone LCD4 Boards 用于:BeagleBone - BB-Bone - Open Source Development Kit |
| MA300016 | 功能描述:子卡和OEM板 dsPICDEM 80-PIN PIM RoHS:否 制造商:BeagleBoard by CircuitCo 产品:BeagleBone LCD4 Boards 用于:BeagleBone - BB-Bone - Open Source Development Kit |
| MA300118 | 功能描述:子卡和OEM板 _ RoHS:否 制造商:BeagleBoard by CircuitCo 产品:BeagleBone LCD4 Boards 用于:BeagleBone - BB-Bone - Open Source Development Kit |
| MA300128 | 功能描述:子卡和OEM板 _ RoHS:否 制造商:BeagleBoard by CircuitCo 产品:BeagleBone LCD4 Boards 用于:BeagleBone - BB-Bone - Open Source Development Kit |
| MA300140 | 功能描述:子卡和OEM板 _ RoHS:否 制造商:BeagleBoard by CircuitCo 产品:BeagleBone LCD4 Boards 用于:BeagleBone - BB-Bone - Open Source Development Kit |
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